Accessories

Part Number	Description / PDF	Quantity
MA330026 Roving Networks / Microchip Technology	MODULE PLUG-IN DSPIC33FJ16MC102	4
STM32HSM-V2ML STMicroelectronics	SAM FOR SECURE FIRMWARE INSTALLA	4
8.06.10 J-LINK RX FINE ADAPTER Segger Microcontroller Systems	ADAPTER J-LINK RX FINE	2
USB-ISO Olimex	1000V ISOLATOR FOR DEV AUDIO DAC	134
6002-410-012 Digilent, Inc.	HIGH CURRENT ADAPTER FOR NI MYRI	0
CY3250-20334QFN-POD IR (Infineon Technologies)	PSOC POD FOR CY8C20334 QFN	0
ATADAPTINY13 Roving Networks / Microchip Technology	ADAPTER PERSON ICE50 TINY13	5
TWR-RF-MRB NXP Semiconductors	MODULE RF TOWER FOR MRB	0
X1 PCI EXPRESS CABLE Broadcom	1 METER PCIE X1 CABLE	0
102990044 Seeed	OPEN WORKBENCH LOGIC SNIFFER	0
AC162060 Roving Networks / Microchip Technology	HEADER INTRFC MPLAB ICD2 20PIN	0
10119 Phase Dock Inc.	1X4 ELECTRONICS MOUNTING CONNECT	25
ASR00013 TinyCircuits	JR SERVO CONNECTOR PIGTAIL 100MM	0
CVM67XM TechTools	MEMBER MODULE PIC12C671/672	1
020-00001 Parallax, Inc.	3 FUNCTION UNIVERSAL REMOTE	0
3548 Adafruit	STRAIGHT HDMI PLUG ADAPTER	1596
PCM18XQ2 Roving Networks / Microchip Technology	MODULE PROCESSOR FOR PIC18F8490	2
300-008 Digilent, Inc.	US TO EU WALL PLUG ADAPTER	0
MA320012 Roving Networks / Microchip Technology	MOD PIM PIC32MZ2048EC 100PIN	5
VA-FC-STYLUS1 Bridgetek	RESISTIVE TOUCH SCREEN STYLUS	31

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Interface Cables	High-speed data transfer, hot-plugging support	USB-UART converters, HDMI breakout cables
Power Modules	Regulated voltage output, battery management	Lipo battery packs, DC-DC converters
Sensor Modules	Digital/analog signal acquisition, calibration-free	Temperature/humidity sensors, IMUs
Expansion Boards	Peripheral interface extension, protocol conversion	Motor drivers, LoRaWAN shields
Debugging Tools	Real-time tracing, voltage measurement	JTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

Parameter	Description
Interface Compatibility	Supports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling	1.8V-24V input range, 5A max current
Signal Integrity	12-bit ADC resolution (0.01% error), 1ns jitter
Environmental Rating	Operating temp: -40 C to +85 C, IP54 dust/water resistance
EMC Compliance	FCC Part 15 Class B, CE EN55032

5. Application Fields

IoT Development: Smart home sensor nodes
Industrial Automation: PLC expansion modules
Consumer Electronics: Prototype gaming controllers
Education: Robotics training platforms
Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

Manufacturer	Representative Products
Arduino	Arduino MKR Shield, Nano I/O Breakout
Raspberry Pi	Pico W Expansion Board, HAT+ Prototyping
STMicroelectronics	ST-Link/V2 Debugger, X-NUCLEO Expansion
Texas Instruments	LaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization