Accessories

Image Part Number Description / PDF Quantity Rfq
MIKROE-2456

MIKROE-2456

MikroElektronika

ECG SENSOR ELECTRODES 30PACK

130

110990027

110990027

Seeed

GROVE 4PIN CABLES 5PCS 20CM

359

XA-SK-GPIO

XA-SK-GPIO

XMOS

GPIO SLICE CARD

0

ADCMXL_BRKOUT/PCBZ

ADCMXL_BRKOUT/PCBZ

Analog Devices, Inc.

ADCMXLXX21 MODULE BREAKOUT BOARD

4

6.68.18 CORTEX-M TRACE REFERENCE BOARD

6.68.18 CORTEX-M TRACE REFERENCE BOARD

Segger Microcontroller Systems

CORTEX-M TRACE REFERENCE BOARD

3

240-000

240-000

Digilent, Inc.

ANALOG PARTS KIT

0

3688

3688

Adafruit

MICRO SD CARD EXTENDER - 68CM LO

243

DKSB1011A

DKSB1011A

PIC24 BREAKOUT BOARD

4

240-015

240-015

Digilent, Inc.

WHEEL KIT PAIR 2.56" DIA D-SLOT

6

10117

10117

Phase Dock Inc.

1X2 ELECTRONICS MOUNTING CONNECT

25

STEVAL-IFW002V1

STEVAL-IFW002V1

STMicroelectronics

BOARD EXTENSION STEVAL-IFW001V1

0

DFR0280

DFR0280

DFRobot

DUST SENSOR ADAPTER

27

3518

3518

Adafruit

LENS ADJUSTMENT TOOL FOR RASPBER

94

CABLE PTC04-A3

CABLE PTC04-A3

Melexis

PTC-04 INTERCONNECTING CABLE

8

DS9120P+

DS9120P+

Maxim Integrated

EVAL BOARD FOR DS9481R

927

FMC-ADC-ADAPTER

FMC-ADC-ADAPTER

Texas Instruments

HEADER ADAPTER CARD

0

IMXAI2ETH-ATH

IMXAI2ETH-ATH

NXP Semiconductors

ENET 1GBPS PHY (STD ENET PHY)

10

DKSB1000C

DKSB1000C

PIC32 BREAKOUT BOARD

17

PRT-14322

PRT-14322

SparkFun

PHOTON STACKABLE HEADER - 12 PIN

0

VA-PSU-US1

VA-PSU-US1

Bridgetek

POWER SUPPLY 5V 1A USB US PLUG

9

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Interface CablesHigh-speed data transfer, hot-plugging supportUSB-UART converters, HDMI breakout cables
Power ModulesRegulated voltage output, battery managementLipo battery packs, DC-DC converters
Sensor ModulesDigital/analog signal acquisition, calibration-freeTemperature/humidity sensors, IMUs
Expansion BoardsPeripheral interface extension, protocol conversionMotor drivers, LoRaWAN shields
Debugging ToolsReal-time tracing, voltage measurementJTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

ParameterDescription
Interface CompatibilitySupports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling1.8V-24V input range, 5A max current
Signal Integrity12-bit ADC resolution (0.01% error), 1ns jitter
Environmental RatingOperating temp: -40 C to +85 C, IP54 dust/water resistance
EMC ComplianceFCC Part 15 Class B, CE EN55032

5. Application Fields

  • IoT Development: Smart home sensor nodes
  • Industrial Automation: PLC expansion modules
  • Consumer Electronics: Prototype gaming controllers
  • Education: Robotics training platforms
  • Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
ArduinoArduino MKR Shield, Nano I/O Breakout
Raspberry PiPico W Expansion Board, HAT+ Prototyping
STMicroelectronicsST-Link/V2 Debugger, X-NUCLEO Expansion
Texas InstrumentsLaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization

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