| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
Embedded Artists |
BOARD QSB BASE LPC4088 |
0 |
|
 |
Bosch Sensortec |
APPLICATION BOARD |
12 |
|
 |
Macchina |
OBD3WAY OBD2 BREAKOUT BOARD |
49 |
|
 |
8.06.20 RL78 14-PIN PROGRAMMING ADAPTER Segger Microcontroller Systems |
RL78 14-PIN PROGRAMMING ADAPTER |
1 |
|
 |
8.06.09 J-LINK MICROCHIP ADAPTER Segger Microcontroller Systems |
ADAPTER J-LINK MICROCHIP |
10 |
|
 |
STMicroelectronics |
BOARD INTERFACE USB TO I2C SEA01 |
0 |
|
 |
OSEPP Electronics |
M/F 4PIN CONN I2C CABLE 8" 4PACK |
544 |
|
 |
NXP Semiconductors |
PHY RISER CARD SGMII/PEX |
2 |
|
 |
Roving Networks / Microchip Technology |
XPLAINED PRO I/O EVAL ADD-ON |
64 |
|
 |
Pimoroni |
CAMERA CABLE JOINER/EXTENDER FOR |
52 |
|
 |
Roving Networks / Microchip Technology |
MODULE PLUG-IN PIC18F87J90 PIM |
0 |
|
 |
Roving Networks / Microchip Technology |
HEADER INTRFC MPLAB ICD2 64/80P |
5 |
|
 |
TechTools |
MEMBER MOD PIC16F73/F74/F76/F77 |
0 |
|
 |
Intersil (Renesas Electronics America) |
USB TO PMBUS ADAPTER, ROHS COMPL |
72 |
|
 |
Texas Instruments |
EVAL MOUDLE LOAD BOARD |
2 |
|
 |
Maxim Integrated |
ADAPTER FOR DS9120 |
6167 |
|
 |
Sanyo Semiconductor/ON Semiconductor |
BOARD DEMO 3 |
20 |
|
 |
Thales DIS (Formerly Gemalto) |
DSB TO EFVAL ADAPTER |
13 |
|
 |
Sanyo Semiconductor/ON Semiconductor |
EVAL BD DYNAMIC LOAD TOOL 100A |
0 |
|
 |
Texas Instruments |
AM57X IDK LCD KIT |
2 |
|
Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.
| Type | Functional Features | Application Examples |
|---|---|---|
| Interface Cables | High-speed data transfer, hot-plugging support | USB-UART converters, HDMI breakout cables |
| Power Modules | Regulated voltage output, battery management | Lipo battery packs, DC-DC converters |
| Sensor Modules | Digital/analog signal acquisition, calibration-free | Temperature/humidity sensors, IMUs |
| Expansion Boards | Peripheral interface extension, protocol conversion | Motor drivers, LoRaWAN shields |
| Debugging Tools | Real-time tracing, voltage measurement | JTAG probes, logic analyzers |
Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads
| Parameter | Description |
|---|---|
| Interface Compatibility | Supports USB 3.0, SPI up to 10MHz, I2C 400kHz |
| Power Handling | 1.8V-24V input range, 5A max current |
| Signal Integrity | 12-bit ADC resolution (0.01% error), 1ns jitter |
| Environmental Rating | Operating temp: -40 C to +85 C, IP54 dust/water resistance |
| EMC Compliance | FCC Part 15 Class B, CE EN55032 |
| Manufacturer | Representative Products |
|---|---|
| Arduino | Arduino MKR Shield, Nano I/O Breakout |
| Raspberry Pi | Pico W Expansion Board, HAT+ Prototyping |
| STMicroelectronics | ST-Link/V2 Debugger, X-NUCLEO Expansion |
| Texas Instruments | LaunchPad SensorHub, BoosterPack MKII |
Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources
Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization