Accessories

Image Part Number Description / PDF Quantity Rfq
114991496

114991496

Seeed

GROVE/BEAGLEBONEBLUE 6PIN 10PACK

23

2AWE17-24

2AWE17-24

Macchina

24-PIN CONNECTOR AND WIRES

100

B-STLINK-ISOL

B-STLINK-ISOL

STMicroelectronics

ISOLATION AND VOLTAGE ADAPTER BO

24

10113

10113

Phase Dock Inc.

2X2 ELECTRONICS MOUNTING CONNECT

25

VNCLO-SHLD-1A

VNCLO-SHLD-1A

Future Technology Devices International, Ltd.

MOD VINCO PIGGYBACK BOARD

3

PIM309

PIM309

Pimoroni

PHAT DIFFUSER

0

PRT-14272

PRT-14272

SparkFun

RASPBERRY PI ZERO CAMERA CABLE

0

XLT08DFN2

XLT08DFN2

Roving Networks / Microchip Technology

SOCKET TRANSITION ICE 14DIP/8DFN

2

TMDSCNCD28335

TMDSCNCD28335

Texas Instruments

DAUGHTER CARD TMS320F28335

15

DS9097U-009#

DS9097U-009#

Maxim Integrated

COM PORT ADAPTER

114398

PRT-14275

PRT-14275

SparkFun

RASPBERRYPI GPIO MALE HEADER

166

CVM5XM

CVM5XM

TechTools

MEMBER MODULE PIC16C5X

0

AC244035

AC244035

Roving Networks / Microchip Technology

IC EXTENSION PAK PIC16F1939

0

PIS-0909

PIS-0909

Pi Supply

RASPBERRY PI COMPATIBLE USB GAME

71

CY3250-21X34QFN-POD

CY3250-21X34QFN-POD

IR (Infineon Technologies)

PSOC POD FOR CY8C21X34 QFN

0

LCD8000-43T

LCD8000-43T

NXP Semiconductors

ACCY MCIMX6UL LCD MODULE 4.3"

20

APEK-USBCBLE-T DK

APEK-USBCBLE-T DK

Allegro MicroSystems

USB CABLE-01 FOR APEK

51

AC002021

AC002021

Roving Networks / Microchip Technology

CABLE MPLAB PM3 ICSP

44

ULINKPRO-5V-ADPT

ULINKPRO-5V-ADPT

Keil (ARM)

ADAPTER 5V ULINKPRO

9

PIM421

PIM421

Pimoroni

WHAT THE FLEX

26

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Interface CablesHigh-speed data transfer, hot-plugging supportUSB-UART converters, HDMI breakout cables
Power ModulesRegulated voltage output, battery managementLipo battery packs, DC-DC converters
Sensor ModulesDigital/analog signal acquisition, calibration-freeTemperature/humidity sensors, IMUs
Expansion BoardsPeripheral interface extension, protocol conversionMotor drivers, LoRaWAN shields
Debugging ToolsReal-time tracing, voltage measurementJTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

ParameterDescription
Interface CompatibilitySupports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling1.8V-24V input range, 5A max current
Signal Integrity12-bit ADC resolution (0.01% error), 1ns jitter
Environmental RatingOperating temp: -40 C to +85 C, IP54 dust/water resistance
EMC ComplianceFCC Part 15 Class B, CE EN55032

5. Application Fields

  • IoT Development: Smart home sensor nodes
  • Industrial Automation: PLC expansion modules
  • Consumer Electronics: Prototype gaming controllers
  • Education: Robotics training platforms
  • Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
ArduinoArduino MKR Shield, Nano I/O Breakout
Raspberry PiPico W Expansion Board, HAT+ Prototyping
STMicroelectronicsST-Link/V2 Debugger, X-NUCLEO Expansion
Texas InstrumentsLaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization

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