Accessories

Part Number	Description / PDF	Quantity
240-024 Digilent, Inc.	ROUND PLATFORM EXPANSION KIT	0
FIT0514 DFRobot	GRAVITY LATTEPANDA CABLE 10PACK	2
240-021-6 Digilent, Inc.	PMOD 6-PIN CABLE KIT W/HEADER	112
PRT-11417 SparkFun	ARDUINO STACKABLE HEADER KIT - R	1310
32201 Parallax, Inc.	PLUG USB-SRL FOR PROPELLER CI	34
163-043 Digilent, Inc.	2 AA BATTERY HOLDER	0
MIKROE-207 MikroElektronika	SMARTADAPT2 WITH GLCD CONNECTOR	0
EVAL-FW-LPSK2 Analog Devices, Inc.	EVAL BOARD LPSK2	1
HW-FMC-XM105-G Xilinx	FMC XM105 CONNECTIVITY CARD	187
EVAL-FW-HPMFB2 Analog Devices, Inc.	DAUGHTER BOARD HPMFB2	0
AC2626J4 Analog Devices, Inc.	GENERAL PURPOSE PROBE IC	0
112990087 Seeed	EMMC MODULE 32G FOR ROCK PI 4	0
ARM-JTAG-20-10 Olimex	JTAG ADAPTER FOR ARM-USB-TINY-H	4086
EVAL-FW-MOTHER Analog Devices, Inc.	EVAL BOARD FW MOTHER	2
8.06.00 J-LINK 19-PIN CORTEX-M ADAPTER Segger Microcontroller Systems	J-LINK 19-PIN CORTEX-M ADAPTER	233
CY3250-24X94QFN IR (Infineon Technologies)	EVAL KITS/TOOLS	0
ATXPRO-10PIN Roving Networks / Microchip Technology	XPRO-10PIN	5
TC2030-MCP-NL-10 Tag-Connect	CABLE IN-CIRCUIT 10" W/O LEGS	0
DKSB1001B	DSPIC33 BREAKOUT BOARD	38
MA330051-1 Roving Networks / Microchip Technology	DSPIC33CK64MC105 PIM MODULE	8

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Interface Cables	High-speed data transfer, hot-plugging support	USB-UART converters, HDMI breakout cables
Power Modules	Regulated voltage output, battery management	Lipo battery packs, DC-DC converters
Sensor Modules	Digital/analog signal acquisition, calibration-free	Temperature/humidity sensors, IMUs
Expansion Boards	Peripheral interface extension, protocol conversion	Motor drivers, LoRaWAN shields
Debugging Tools	Real-time tracing, voltage measurement	JTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

Parameter	Description
Interface Compatibility	Supports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling	1.8V-24V input range, 5A max current
Signal Integrity	12-bit ADC resolution (0.01% error), 1ns jitter
Environmental Rating	Operating temp: -40 C to +85 C, IP54 dust/water resistance
EMC Compliance	FCC Part 15 Class B, CE EN55032

5. Application Fields

IoT Development: Smart home sensor nodes
Industrial Automation: PLC expansion modules
Consumer Electronics: Prototype gaming controllers
Education: Robotics training platforms
Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

Manufacturer	Representative Products
Arduino	Arduino MKR Shield, Nano I/O Breakout
Raspberry Pi	Pico W Expansion Board, HAT+ Prototyping
STMicroelectronics	ST-Link/V2 Debugger, X-NUCLEO Expansion
Texas Instruments	LaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization