Accessories

Image Part Number Description / PDF Quantity Rfq
MA180013

MA180013

Roving Networks / Microchip Technology

MODULE PLUG-IN 18F45J10 44TQFP

0

MPCL87784

MPCL87784

Vishay / Dale

8 PIN ENCODER CABLE

15

I3-DB18F4431

I3-DB18F4431

RF Solutions

BOARD DAUGHTER ICEPIC3

9

MA330035

MA330035

Roving Networks / Microchip Technology

MOD PIM DSPIC33EP512GM710 GP

4

AC162051

AC162051

Roving Networks / Microchip Technology

HEADER INTRFC ICD,ICD2 28/40 DIP

6

TC2050-XILINX

TC2050-XILINX

Tag-Connect

ADAPTER TC2050 FOR XILINX CABLE

5

ECG-PRO-3-WAY-CABLE

ECG-PRO-3-WAY-CABLE

Olimex

ECG CABLE 3 WIRES FOR GEL ELECTR

0

32115

32115

Parallax, Inc.

JTAGULATOR

3

IS-P410905

IS-P410905

NKK Switches

POWER SUPPLY 11W 9VDC 0.5A

0

RIOT-C01

RIOT-C01

RICOH Electronic Devices Co., LTD.

COIN BATTERY BOARD FOR ENVIRONME

10

FCB-3250-SMT

FCB-3250-SMT

Terasic

DE4 TO DE4 HSMC CABLE

21

RS485-C2(UN)

RS485-C2(UN)

Equinox Technologies

MODULE CONVERTER RS232 TO RS485

0

450-00308

450-00308

Parallax, Inc.

CONNECTOR SOCKET FOR P2 EDGE (RI

25

PTC04-DB-922XX

PTC04-DB-922XX

Melexis

PTC04 DAUGHTERBOARD 922XX

2

ATATMEL-ICE-ADPT

ATATMEL-ICE-ADPT

Roving Networks / Microchip Technology

ADAPTER SAM ICE

46

CRD-HDMI-DC

CRD-HDMI-DC

Cirrus Logic

BOARD REF HDMI DAUGHTER CARD

2

AC162091

AC162091

Roving Networks / Microchip Technology

HEADER MPLAB ICD2 18F87J11 64/80

0

SHIELD-EKG-EMG-PA

SHIELD-EKG-EMG-PA

Olimex

PASSIVE ELECTRODE FOR SHIELD

11

DPS-DONGLE-EVM

DPS-DONGLE-EVM

Texas Instruments

DONGLE

4

DC2510A

DC2510A

Analog Devices, Inc.

DEMO SHIELD BOARD FOR DC2321A

2

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Interface CablesHigh-speed data transfer, hot-plugging supportUSB-UART converters, HDMI breakout cables
Power ModulesRegulated voltage output, battery managementLipo battery packs, DC-DC converters
Sensor ModulesDigital/analog signal acquisition, calibration-freeTemperature/humidity sensors, IMUs
Expansion BoardsPeripheral interface extension, protocol conversionMotor drivers, LoRaWAN shields
Debugging ToolsReal-time tracing, voltage measurementJTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

ParameterDescription
Interface CompatibilitySupports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling1.8V-24V input range, 5A max current
Signal Integrity12-bit ADC resolution (0.01% error), 1ns jitter
Environmental RatingOperating temp: -40 C to +85 C, IP54 dust/water resistance
EMC ComplianceFCC Part 15 Class B, CE EN55032

5. Application Fields

  • IoT Development: Smart home sensor nodes
  • Industrial Automation: PLC expansion modules
  • Consumer Electronics: Prototype gaming controllers
  • Education: Robotics training platforms
  • Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
ArduinoArduino MKR Shield, Nano I/O Breakout
Raspberry PiPico W Expansion Board, HAT+ Prototyping
STMicroelectronicsST-Link/V2 Debugger, X-NUCLEO Expansion
Texas InstrumentsLaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization

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