Accessories

Part Number	Description / PDF	Quantity
PTC04_DB_PRESSURE01 Melexis	PTC04 DAUGHTERBOARD PRESSURE01	6
110060009 Seeed	STARTER BUNDLE HARNESS	0
AC244033 Roving Networks / Microchip Technology	EXTENSION PAK PIC18F14K22-ICE	1
COM-09277 SparkFun	BUTTON PAD 2X2 - BREAKOUT PCB	0
PCM18XK1 Roving Networks / Microchip Technology	MODULE PROC PIC18F8680,6680,8565	5
240-114 Digilent, Inc.	PYNQ-Z1 ACCESSORY KIT	0
240-021-2 Digilent, Inc.	PMOD 12-PIN CABLE KIT W/HEADER	113
CWH-CTP-CTX10-YE NXP Semiconductors	HDWR CW TAP PROBE TIP LS1 LS2	4
PRT-17253 SparkFun	MICRO:BIT EDGE CONNECTOR - SMD,	0
ATARDADPT-XPRO Roving Networks / Microchip Technology	BOARD ADAPTER FOR ARDUINO XPRO	3
PIM011 Pimoroni	OMNIVESA MOUNT FOR RASPBERRY PI	15
LIFMD-IOL-EVN Lattice Semiconductor	CROSSLINK LIF-MD6000 IO LINK BRD	11
20-101-1338 Digi	BOARD INTERFACE RCM6700	94
WIG-17264 SparkFun	8BITDO SN30 PRO BLUETOOTH GAMEPA	24
MA990002 Roving Networks / Microchip Technology	CEC1712H-S2 PLUG-IN MODULE	2
240-109 Digilent, Inc.	2X6 12-PIN 7INCH CABLE	0
20-101-0542 Digi	CABLE 1.27MM FOR RCM3200	127
920-0055-01 SchmartBoard	10" FEMALE PIC PROGRAMMING CABLE	4
STMPRIMER-BASE STMicroelectronics	MODULE FOR STM8/STM32 PRIM BOARD	0
EVAL-CFTL-LVDT Analog Devices, Inc.	SENSOR LVDT E-100 ECONOMY SERIES	11

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Interface Cables	High-speed data transfer, hot-plugging support	USB-UART converters, HDMI breakout cables
Power Modules	Regulated voltage output, battery management	Lipo battery packs, DC-DC converters
Sensor Modules	Digital/analog signal acquisition, calibration-free	Temperature/humidity sensors, IMUs
Expansion Boards	Peripheral interface extension, protocol conversion	Motor drivers, LoRaWAN shields
Debugging Tools	Real-time tracing, voltage measurement	JTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

Parameter	Description
Interface Compatibility	Supports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling	1.8V-24V input range, 5A max current
Signal Integrity	12-bit ADC resolution (0.01% error), 1ns jitter
Environmental Rating	Operating temp: -40 C to +85 C, IP54 dust/water resistance
EMC Compliance	FCC Part 15 Class B, CE EN55032

5. Application Fields

IoT Development: Smart home sensor nodes
Industrial Automation: PLC expansion modules
Consumer Electronics: Prototype gaming controllers
Education: Robotics training platforms
Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

Manufacturer	Representative Products
Arduino	Arduino MKR Shield, Nano I/O Breakout
Raspberry Pi	Pico W Expansion Board, HAT+ Prototyping
STMicroelectronics	ST-Link/V2 Debugger, X-NUCLEO Expansion
Texas Instruments	LaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization