Accessories

Image Part Number Description / PDF Quantity Rfq
8.08.01 J-LINK 14-PIN ARM ADAPTER

8.08.01 J-LINK 14-PIN ARM ADAPTER

Segger Microcontroller Systems

J-LINK 14-PIN ARM ADAPTER

6

64018

64018

Parallax, Inc.

P2 EDGE 80-PIN ADAPTER KIT

8

CONFIG MODULE 0107

CONFIG MODULE 0107

Broadcom

CONFIGURATION MODULE 0107

0

XA-SK-SCR480

XA-SK-SCR480

XMOS

DISPLAY SLICE CARD

0

TWR-ELEV

TWR-ELEV

NXP Semiconductors

TOWER ELEVATOR HARDWARE 2 BOARDS

51

PCM16YG0

PCM16YG0

Roving Networks / Microchip Technology

MODULE PROCESSOR PIC16F87,88

1

AC164111

AC164111

Roving Networks / Microchip Technology

ADAPTER PM3 ICSP TO RJ-11

8

3888

3888

Adafruit

SMT STRAIGHT CONNECTOR FOR MICRO

0

CC256XEM-STADAPT

CC256XEM-STADAPT

Texas Instruments

KIT ADAPTER FOR CC256X

8

A13-OLINUXINO-DEBIAN-SD

A13-OLINUXINO-DEBIAN-SD

Olimex

MICRO SD CARD DEBIAN LINUX

0

VNCLO-PSU-USA

VNCLO-PSU-USA

Future Technology Devices International, Ltd.

POWER SUPPLY FOR VNCLO-MB1A USA

0

8.06.06 J-LINK TI-CTI-20 ADAPTER

8.06.06 J-LINK TI-CTI-20 ADAPTER

Segger Microcontroller Systems

ADAPTER J-LINK TI-CTI-20 20PIN

15

PRT-14311

PRT-14311

SparkFun

ESP32 STACKABLE HEADER SET

228

TMCM-0013-CABLE

TMCM-0013-CABLE

TRINAMIC Motion Control GmbH

CABLE LOOM FOR TMCM-0013-XA

4

2940

2940

Adafruit

SHORT FEATHER HEADERS KIT - 12-P

1203

112990088

112990088

Seeed

EMMC MODULE 64G FOR ROCK PI 4

0

AD-DAC-FMC-ADP

AD-DAC-FMC-ADP

Analog Devices, Inc.

BOARD ADAPTER FOR DPG2 XILINX

11

10118

10118

Phase Dock Inc.

1X3 ELECTRONICS MOUNTING CONNECT

25

KIT_XMC4X_UNI_EXT01_001

KIT_XMC4X_UNI_EXT01_001

IR (Infineon Technologies)

KIT EXTENSION FOR XMC4500

5

240-052

240-052

Digilent, Inc.

MINI GRABBERS TEST CLIP SET OF 6

17

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Interface CablesHigh-speed data transfer, hot-plugging supportUSB-UART converters, HDMI breakout cables
Power ModulesRegulated voltage output, battery managementLipo battery packs, DC-DC converters
Sensor ModulesDigital/analog signal acquisition, calibration-freeTemperature/humidity sensors, IMUs
Expansion BoardsPeripheral interface extension, protocol conversionMotor drivers, LoRaWAN shields
Debugging ToolsReal-time tracing, voltage measurementJTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

ParameterDescription
Interface CompatibilitySupports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling1.8V-24V input range, 5A max current
Signal Integrity12-bit ADC resolution (0.01% error), 1ns jitter
Environmental RatingOperating temp: -40 C to +85 C, IP54 dust/water resistance
EMC ComplianceFCC Part 15 Class B, CE EN55032

5. Application Fields

  • IoT Development: Smart home sensor nodes
  • Industrial Automation: PLC expansion modules
  • Consumer Electronics: Prototype gaming controllers
  • Education: Robotics training platforms
  • Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
ArduinoArduino MKR Shield, Nano I/O Breakout
Raspberry PiPico W Expansion Board, HAT+ Prototyping
STMicroelectronicsST-Link/V2 Debugger, X-NUCLEO Expansion
Texas InstrumentsLaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization

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