Accessories

Part Number	Description / PDF	Quantity
ATAVR-SOAKIT Roving Networks / Microchip Technology	KIT ADAPTER STANDOFF JTAG DEBUG	0
FFI2C-01 OSEPP Electronics	F/F 4PIN CONN I2C CABLE 8" 4PACK	191
AC300022 Roving Networks / Microchip Technology	MOTOR 3PHASE W/ 250 LINE ENCODER	6
CVM61M TechTools	MEMBER MODULE PIC16C61	0
S5U13U00P00C100 Epson	BOARD ADAPT USB FOR S5U13513P00C	0
HSC-ADC-EVALEZ Analog Devices, Inc.	EVAL PLATFORM HIGH SPEED ADC	0
3559 Adafruit	STRAIGHT MICRO HDMI SOCKET ADAPT	12
310-053 Digilent, Inc.	CABLE USB A TO MICRO B	55
MA320017 Roving Networks / Microchip Technology	PIC32MX270F512L PIM FOR BT ADK	0
CVM5XF TechTools	FAMILY MODULE PIC16C5X	0
AC162070 Roving Networks / Microchip Technology	HEADER INTRFC MPLAB ICD2 8/14P	0
MIKROE-128 MikroElektronika	BOARD EASYCONNECT	0
MCIMX-LVDS1 NXP Semiconductors	DAUGHTER CARD LVDS FOR I.MX53	13
5622 Kitronik	AUDIO CABLE FOR BBC MICRO:BIT	167
103990444 Seeed	EMMC READER FOR ROCK PI 4	48
CY3201-06 Cypress Semiconductor	MCU EMULATOR POD FOR 20-SSOP	4
PRT-14429 SparkFun	QWIIC CABLE - 500MM	621
FIT0084-B DFRobot	0.1" (2.54 MM) ARDUINO MALE PIN	26
MA320003 Roving Networks / Microchip Technology	MODULE PLUG-IN PIC32 CAN USB	46
3554 Adafruit	RIGHT ANGLE (L BEND) MINI HDMI P	3

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Interface Cables	High-speed data transfer, hot-plugging support	USB-UART converters, HDMI breakout cables
Power Modules	Regulated voltage output, battery management	Lipo battery packs, DC-DC converters
Sensor Modules	Digital/analog signal acquisition, calibration-free	Temperature/humidity sensors, IMUs
Expansion Boards	Peripheral interface extension, protocol conversion	Motor drivers, LoRaWAN shields
Debugging Tools	Real-time tracing, voltage measurement	JTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

Parameter	Description
Interface Compatibility	Supports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling	1.8V-24V input range, 5A max current
Signal Integrity	12-bit ADC resolution (0.01% error), 1ns jitter
Environmental Rating	Operating temp: -40 C to +85 C, IP54 dust/water resistance
EMC Compliance	FCC Part 15 Class B, CE EN55032

5. Application Fields

IoT Development: Smart home sensor nodes
Industrial Automation: PLC expansion modules
Consumer Electronics: Prototype gaming controllers
Education: Robotics training platforms
Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

Manufacturer	Representative Products
Arduino	Arduino MKR Shield, Nano I/O Breakout
Raspberry Pi	Pico W Expansion Board, HAT+ Prototyping
STMicroelectronics	ST-Link/V2 Debugger, X-NUCLEO Expansion
Texas Instruments	LaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization