Accessories

Image Part Number Description / PDF Quantity Rfq
LCMXO2-4000HE-SEC-EVN

LCMXO2-4000HE-SEC-EVN

Lattice Semiconductor

BOARD MACHXO2 SENSOR EXTENDER

0

110990040

110990040

Seeed

GROVE 4PIN CABLES 5PACK 30CM

121

PTC-04-DB-FL

PTC-04-DB-FL

Melexis

PTC04 DAUGHTERBOARD FL

0

AGB2N0CS-GEVK

AGB2N0CS-GEVK

Sanyo Semiconductor/ON Semiconductor

DEMO 3 ADAPTER

12

250-084

250-084

Digilent, Inc.

MOTOR EXTENDER CABLE

9

163-053

163-053

Digilent, Inc.

DIP SOCKET 40-PIN

0

31645

31645

dresden elektronik

SET USB LEVEL SHIFT STICK LO PWR

0

STEVAL-ILL009V3

STEVAL-ILL009V3

STMicroelectronics

BOARD EVAL MOD OSTAR PROJECTION

0

MA180032

MA180032

Roving Networks / Microchip Technology

MODULE PLUG-IN PIC18F66K80

5

ADS7-V2EBZ

ADS7-V2EBZ

Analog Devices, Inc.

EVAL BOARD HDV6/DPG3

21

CY3250-28XXX

CY3250-28XXX

Cypress Semiconductor

KIT EMULATION PSOC CY8C28XXX

2

PRT-14017

PRT-14017

SparkFun

RASPBERRY PI GPIO TALL HEADER

1185

2000035665

2000035665

Basler

DART I/O ADAPTER BOARD MOUNTING

0

IS-SERIAL-CABLE

IS-SERIAL-CABLE

NKK Switches

SERIAL CBL RJ11-DB9 FOR DEV KIT

1950

1658

1658

Adafruit

GPIO HEADER FOR RASPBERRY PI - E

0

TMCM-1617-BB

TMCM-1617-BB

TRINAMIC Motion Control GmbH

BASEBOARD FOR TMCM-1617 SERVO DR

4

FRDM-PWRSTG1EVB

FRDM-PWRSTG1EVB

NXP Semiconductors

GD3000 MOSFET ACCESSORY BOARD

3

240-023

240-023

Digilent, Inc.

ANGLED PLATFORM EXPANSION KIT

0

PTC-TESTBENCH-MAGNETIC

PTC-TESTBENCH-MAGNETIC

Melexis

PTC04 TESTBENCH MAGNETIC

0

AC320101

AC320101

Roving Networks / Microchip Technology

ADAPTER BOARD MEB/II UART TO USB

6

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Interface CablesHigh-speed data transfer, hot-plugging supportUSB-UART converters, HDMI breakout cables
Power ModulesRegulated voltage output, battery managementLipo battery packs, DC-DC converters
Sensor ModulesDigital/analog signal acquisition, calibration-freeTemperature/humidity sensors, IMUs
Expansion BoardsPeripheral interface extension, protocol conversionMotor drivers, LoRaWAN shields
Debugging ToolsReal-time tracing, voltage measurementJTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

ParameterDescription
Interface CompatibilitySupports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling1.8V-24V input range, 5A max current
Signal Integrity12-bit ADC resolution (0.01% error), 1ns jitter
Environmental RatingOperating temp: -40 C to +85 C, IP54 dust/water resistance
EMC ComplianceFCC Part 15 Class B, CE EN55032

5. Application Fields

  • IoT Development: Smart home sensor nodes
  • Industrial Automation: PLC expansion modules
  • Consumer Electronics: Prototype gaming controllers
  • Education: Robotics training platforms
  • Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
ArduinoArduino MKR Shield, Nano I/O Breakout
Raspberry PiPico W Expansion Board, HAT+ Prototyping
STMicroelectronicsST-Link/V2 Debugger, X-NUCLEO Expansion
Texas InstrumentsLaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization

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