Accessories

Image Part Number Description / PDF Quantity Rfq
201884

201884

Watterott electronic

SILENTSTEPSTICK TESTER

95

AC162058

AC162058

Roving Networks / Microchip Technology

HEADER MPLAB ICD2 FOR PIC12F683

0

CY3250-28XXX-POD

CY3250-28XXX-POD

Cypress Semiconductor

KIT REPLACEMENT PODS CY8C28XXX

3

TWR-WIFI-RS2101

TWR-WIFI-RS2101

NXP Semiconductors

TOWER SYSTEM EVAL 802.11N

0

700-00056

700-00056

Parallax, Inc.

BENT WHISKERS

27

2MTR-DYNO

2MTR-DYNO

Texas Instruments

DEV KIT DC MOTOR

16

MIKROE-205

MIKROE-205

MikroElektronika

SMARTADAPT2 BOARD

0

ATPROTO1-XPRO

ATPROTO1-XPRO

Roving Networks / Microchip Technology

XPLAINED PRO PROTOTYPING ADD-ON

17

CVM711M

CVM711M

TechTools

MEMBER MODULE PIC16C71

0

EXTENSION BOARD V.4.0

EXTENSION BOARD V.4.0

TDK Micronas

EXTENSION BOARD V4.0 USB PROGR

11

ADZS-SHAUDIO-EZEXT

ADZS-SHAUDIO-EZEXT

Analog Devices, Inc.

SHARC AUDIO EZ-EXTENDER

2

SLSDA001A

SLSDA001A

Silicon Labs

DEBUG ADAPT KIT

563

PCM16XB1

PCM16XB1

Roving Networks / Microchip Technology

PROCESSOR MODULE FOR MPLAB-ICE

1

4377

4377

Adafruit

SMARTIPI TOUCH 2 RASPBERRY PI

67

PRT-17152

PRT-17152

SparkFun

TEENSY STACKABLE HEADER KIT (EXT

110

KIT2K5WCCMTOLLTOBO1

KIT2K5WCCMTOLLTOBO1

IR (Infineon Technologies)

TO LEADLESS ADAPTER

3

MCIMX28LCD

MCIMX28LCD

NXP Semiconductors

EVAL KIT W/LCD FOR I.MX28

5

EVI-ED8100COMMIF

EVI-ED8100COMMIF

Intel

DONGLE FOR ED8100 SERIES

2

1863

1863

Adafruit

SLIDE SWITCH BREAKOUT

93

KIT6W12VP7950VTOBO1

KIT6W12VP7950VTOBO1

IR (Infineon Technologies)

EVAL BOARD FOR ICE5QSAG

189

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Interface CablesHigh-speed data transfer, hot-plugging supportUSB-UART converters, HDMI breakout cables
Power ModulesRegulated voltage output, battery managementLipo battery packs, DC-DC converters
Sensor ModulesDigital/analog signal acquisition, calibration-freeTemperature/humidity sensors, IMUs
Expansion BoardsPeripheral interface extension, protocol conversionMotor drivers, LoRaWAN shields
Debugging ToolsReal-time tracing, voltage measurementJTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

ParameterDescription
Interface CompatibilitySupports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling1.8V-24V input range, 5A max current
Signal Integrity12-bit ADC resolution (0.01% error), 1ns jitter
Environmental RatingOperating temp: -40 C to +85 C, IP54 dust/water resistance
EMC ComplianceFCC Part 15 Class B, CE EN55032

5. Application Fields

  • IoT Development: Smart home sensor nodes
  • Industrial Automation: PLC expansion modules
  • Consumer Electronics: Prototype gaming controllers
  • Education: Robotics training platforms
  • Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
ArduinoArduino MKR Shield, Nano I/O Breakout
Raspberry PiPico W Expansion Board, HAT+ Prototyping
STMicroelectronicsST-Link/V2 Debugger, X-NUCLEO Expansion
Texas InstrumentsLaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization

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