Accessories

Part Number	Description / PDF	Quantity
310-025 Digilent, Inc.	2-PIN MTE POWER CABLE	0
MA330041-2 Roving Networks / Microchip Technology	DSPIC33CK256MP508 INTERNAL OPAMP	2
BB-BONE-BATT-01	BEAGLEBONE BATTERY CAPE	12
STEVAL-IKA001V1 STMicroelectronics	BOARD EVAL FOR STM32	0
MIKROE-193 MikroElektronika	BOARD EASYPROTO	0
MIKROE-1303 MikroElektronika	ADAPTER MIKROPROG TO ST-LINK V2	34
AC244064 Roving Networks / Microchip Technology	EXTENSION PAK PIC16(L)F1789	0
ZENETSC0100ZACG Zilog / Littelfuse	KIT ACC ETHERNET SMART CABLE	0
ACICE0401 Roving Networks / Microchip Technology	POWER SUPPLY FOR MPLAB 3.3V/5V	13
ASR00014-100 TinyCircuits	3-PIN JST-SH PIGTAIL 100MM	0
AVR-ICSP Olimex	6 - 10 PIN CROSS CONNECTION ADAP	86
316010012 Seeed	GALVANOMETER MOTOR (SC17-15K)	0
ATETHERNET1-XPRO Roving Networks / Microchip Technology	KIT ETHERNET PRO	6
MA180035 Roving Networks / Microchip Technology	PIC18F66K80 100 PIN PLUG-IN MODU	5
4792 Adafruit	MICRO:BIT OR CLUE CONNECTOR - SU	46
PTC-04-DB-DEBUG Melexis	PTC04 DAUGHTERBOARD DEBUG	0
27111 Parallax, Inc.	ADAPTER BASIC STAMP 1 SERIAL	2
RCB-F9T u-blox	ZED-F9T TIMING BOARD	0
FIT0011 DFRobot	DIGITAL SENSOR CABLE 10PACK	6
CWH-CTP-COP-YE NXP Semiconductors	CODEWARRIOR TAP PROBE TIP	38

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Interface Cables	High-speed data transfer, hot-plugging support	USB-UART converters, HDMI breakout cables
Power Modules	Regulated voltage output, battery management	Lipo battery packs, DC-DC converters
Sensor Modules	Digital/analog signal acquisition, calibration-free	Temperature/humidity sensors, IMUs
Expansion Boards	Peripheral interface extension, protocol conversion	Motor drivers, LoRaWAN shields
Debugging Tools	Real-time tracing, voltage measurement	JTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

Parameter	Description
Interface Compatibility	Supports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling	1.8V-24V input range, 5A max current
Signal Integrity	12-bit ADC resolution (0.01% error), 1ns jitter
Environmental Rating	Operating temp: -40 C to +85 C, IP54 dust/water resistance
EMC Compliance	FCC Part 15 Class B, CE EN55032

5. Application Fields

IoT Development: Smart home sensor nodes
Industrial Automation: PLC expansion modules
Consumer Electronics: Prototype gaming controllers
Education: Robotics training platforms
Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

Manufacturer	Representative Products
Arduino	Arduino MKR Shield, Nano I/O Breakout
Raspberry Pi	Pico W Expansion Board, HAT+ Prototyping
STMicroelectronics	ST-Link/V2 Debugger, X-NUCLEO Expansion
Texas Instruments	LaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization