Accessories

Image Part Number Description / PDF Quantity Rfq
PCM18XD1

PCM18XD1

Roving Networks / Microchip Technology

MODULE PIC18F248/258/448/458

1

LS400-BB

LS400-BB

LogiSwitch

ARDUINO WB KIT BAREBONES

100

USB INTERFACE BOARD

USB INTERFACE BOARD

ams

USB INTERFACE BOARD - PC LINK

0

TC2070-IDC-NL

TC2070-IDC-NL

Tag-Connect

CABLE ASSM 14PIN PLUG

34

317990279

317990279

Seeed

USB CP2102 SERIAL CONVERTER

41

MXOV10635-S32V

MXOV10635-S32V

NXP Semiconductors

MAXIM LVDS CAMERA FOR SBC-S32V23

7

MAXPMBAE1#

MAXPMBAE1#

Maxim Integrated

COLLECTION OF PLUG-IN EVAL MOD'S

613

MA240038

MA240038

Roving Networks / Microchip Technology

MODULE PIM PIC24FJ256GB410

4

MCIMX51LCD

MCIMX51LCD

NXP Semiconductors

DAUGHTER LCD WVGA I.MX51

2

2BH17

2BH17

Macchina

M2 INTERFACE BOARD (UTH)

99

FIT0630

FIT0630

DFRobot

30PIN 15CM FPC CABLE FOR LATTEPA

15

8.06.03 J-LINK 14-PIN TI ADAPTER

8.06.03 J-LINK 14-PIN TI ADAPTER

Segger Microcontroller Systems

ADAPTER J-LINK TI JTAG 14PIN

19

114020161

114020161

Seeed

GROVE FEMALE HEADER 600PACK

0

114020164

114020164

Seeed

GROVE FEMALE HEADER R/A 20PACK

51

310-051

310-051

Digilent, Inc.

HDMI TYPE A-D MICRO CABLE 40INCH

0

MINISASTOCSI

MINISASTOCSI

NXP Semiconductors

OV5640 MIPI CSI BOARD (MINI SAS)

15

8.06.17 SILABS C2 ADAPTER

8.06.17 SILABS C2 ADAPTER

Segger Microcontroller Systems

SILABS C2 ADAPTER

3

USEQCSK0000000

USEQCSK0000000

KEMET

CONTROL BRD FOR MODULES MAX 4

3

8.06.05 10-PIN NEEDLE ADAPTER

8.06.05 10-PIN NEEDLE ADAPTER

Segger Microcontroller Systems

10-PIN NEEDLE ADAPTER

0

FIT0084-Y

FIT0084-Y

DFRobot

0.1" (2.54 MM) ARDUINO MALE PIN

14

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Interface CablesHigh-speed data transfer, hot-plugging supportUSB-UART converters, HDMI breakout cables
Power ModulesRegulated voltage output, battery managementLipo battery packs, DC-DC converters
Sensor ModulesDigital/analog signal acquisition, calibration-freeTemperature/humidity sensors, IMUs
Expansion BoardsPeripheral interface extension, protocol conversionMotor drivers, LoRaWAN shields
Debugging ToolsReal-time tracing, voltage measurementJTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

ParameterDescription
Interface CompatibilitySupports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling1.8V-24V input range, 5A max current
Signal Integrity12-bit ADC resolution (0.01% error), 1ns jitter
Environmental RatingOperating temp: -40 C to +85 C, IP54 dust/water resistance
EMC ComplianceFCC Part 15 Class B, CE EN55032

5. Application Fields

  • IoT Development: Smart home sensor nodes
  • Industrial Automation: PLC expansion modules
  • Consumer Electronics: Prototype gaming controllers
  • Education: Robotics training platforms
  • Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
ArduinoArduino MKR Shield, Nano I/O Breakout
Raspberry PiPico W Expansion Board, HAT+ Prototyping
STMicroelectronicsST-Link/V2 Debugger, X-NUCLEO Expansion
Texas InstrumentsLaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization

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