Accessories

Image Part Number Description / PDF Quantity Rfq
DC2086A

DC2086A

Analog Devices, Inc.

POWERED PROGRAMMING ADAPTER FOR

24

TMDSADPEMU-20A

TMDSADPEMU-20A

Texas Instruments

ADAPTER JTAG EMULATOR 14/20 PIN

1

TWR-LCDC-EPSON

TWR-LCDC-EPSON

NXP Semiconductors

MOD EPSON DISPLAY CONTROL

2

MA160016

MA160016

Roving Networks / Microchip Technology

MODULE PLUG-IN PIC16F1947

0

AEK-CON-5SLOTS1

AEK-CON-5SLOTS1

STMicroelectronics

5-SLOT AUTODEVKIT CONNECTOR BOAR

20

ZUSBSC00100ZACG

ZUSBSC00100ZACG

Zilog / Littelfuse

KIT ACCESSORY USB SMART CABLE

76

BB-BONE-MOTOR-02

BB-BONE-MOTOR-02

BEAGLEBONE MOTOR SCREW BLOK CAPE

6

2AWE17-26

2AWE17-26

Macchina

26-PIN CONNECTOR AND WIRES

498

EVAL-ADUSB2EBZ

EVAL-ADUSB2EBZ

Analog Devices, Inc.

USBI BRD USB TO SPI/I2C

83

3907

3907

Adafruit

COLOR CODED HEADER FOR RASPBERRY

0

240-057

240-057

Digilent, Inc.

12V, 3A POWER SUPPLY

0

TMDSEMU110-ETH

TMDSEMU110-ETH

Texas Instruments

TMDSEMU110-ETH

5

110990031

110990031

Seeed

GROVE 4PIN CABLES 5PACK 20CM

86

106990006

106990006

Seeed

ATX BREAKOUT BOARD BENCH POWER S

18

MIKROE-571

MIKROE-571

MikroElektronika

BOARD EASYLED W/RED DIODES

2

CAB-ARM-20W

CAB-ARM-20W

Equinox Technologies

CABLE RIBBON 20WAY IDC PRGRM

4

240-005

240-005

Digilent, Inc.

1-PIN MTE CABLE PACK OF 5

12

AC162078

AC162078

Roving Networks / Microchip Technology

HEADER INTRFC MPLAB ICD2 18F1330

0

WIG-17266

WIG-17266

SparkFun

8BITDO LITE BLUETOOTH GAMEPAD -

25

CABLE-40-40-10CM

CABLE-40-40-10CM

Olimex

DATA/TOUCHSCREEN CABLE FOR OLINU

0

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Interface CablesHigh-speed data transfer, hot-plugging supportUSB-UART converters, HDMI breakout cables
Power ModulesRegulated voltage output, battery managementLipo battery packs, DC-DC converters
Sensor ModulesDigital/analog signal acquisition, calibration-freeTemperature/humidity sensors, IMUs
Expansion BoardsPeripheral interface extension, protocol conversionMotor drivers, LoRaWAN shields
Debugging ToolsReal-time tracing, voltage measurementJTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

ParameterDescription
Interface CompatibilitySupports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling1.8V-24V input range, 5A max current
Signal Integrity12-bit ADC resolution (0.01% error), 1ns jitter
Environmental RatingOperating temp: -40 C to +85 C, IP54 dust/water resistance
EMC ComplianceFCC Part 15 Class B, CE EN55032

5. Application Fields

  • IoT Development: Smart home sensor nodes
  • Industrial Automation: PLC expansion modules
  • Consumer Electronics: Prototype gaming controllers
  • Education: Robotics training platforms
  • Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
ArduinoArduino MKR Shield, Nano I/O Breakout
Raspberry PiPico W Expansion Board, HAT+ Prototyping
STMicroelectronicsST-Link/V2 Debugger, X-NUCLEO Expansion
Texas InstrumentsLaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization

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