Accessories

Image Part Number Description / PDF Quantity Rfq
ATUSB-I2C-AUTO-PCB

ATUSB-I2C-AUTO-PCB

Roving Networks / Microchip Technology

USBI2CAUTOPCB

21

ADALP2000

ADALP2000

Analog Devices, Inc.

KIT PARTS ACTIVE LEARNING

870

ACC1600-01

ACC1600-01

Adapteva

PARALLELLA-16 PORCUPINE BOARD

0

10136

10136

Phase Dock Inc.

RASPBERRY PI 3,4 MOUNTING ADAPTE

25

10143

10143

Phase Dock Inc.

700 PT BREADBOARD MOUNTING ADAPT

25

AC162053

AC162053

Roving Networks / Microchip Technology

HEADER INTERFACE ICD,ICD2 18DIP

0

DM160236

DM160236

Roving Networks / Microchip Technology

POE PROGRAMMER ADAPTER

0

20-101-0513

20-101-0513

Digi

CABLE PROGRAMMING RS232

80

240-108

240-108

Digilent, Inc.

ACCY PROJECT BOX + STICKER SHEET

17

EVAL-SDP-CB1Z

EVAL-SDP-CB1Z

Analog Devices, Inc.

BOARD EVALUATION FOR SDP-CB1

256

800-00003

800-00003

Parallax, Inc.

CABLE SERIAL PROGRAMMING

0

VA-PSU-UK1

VA-PSU-UK1

Bridgetek

POWER SUPPLY 5V 1A USB UK PLUG

0

MLX LIN MASTER

MLX LIN MASTER

Melexis

LIN MASTER FOR BUS-PC USB CONN

0

FIT0504

FIT0504

DFRobot

ALUMINUM HEATSINK COOLING FAN FO

38

114020162

114020162

Seeed

GROVE FEMALE HEADER R/A 600PACK

0

EA-XPR-301

EA-XPR-301

Embedded Artists

KIT EXPERIMENT LPC812 MAX

0

CVM5XXM

CVM5XXM

TechTools

MEMBR MOD PIC12C50X/CE51X/16C505

0

20-101-0612

20-101-0612

Digi

CARD I/O EXPANSION DGTL RN1100

33

TC2030-IDC

TC2030-IDC

Tag-Connect

CABLE ADAPTER 6 POS

693

114992067

114992067

Seeed

RF EXPLORER RPI TOUCH SCREEN HOL

63

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Interface CablesHigh-speed data transfer, hot-plugging supportUSB-UART converters, HDMI breakout cables
Power ModulesRegulated voltage output, battery managementLipo battery packs, DC-DC converters
Sensor ModulesDigital/analog signal acquisition, calibration-freeTemperature/humidity sensors, IMUs
Expansion BoardsPeripheral interface extension, protocol conversionMotor drivers, LoRaWAN shields
Debugging ToolsReal-time tracing, voltage measurementJTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

ParameterDescription
Interface CompatibilitySupports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling1.8V-24V input range, 5A max current
Signal Integrity12-bit ADC resolution (0.01% error), 1ns jitter
Environmental RatingOperating temp: -40 C to +85 C, IP54 dust/water resistance
EMC ComplianceFCC Part 15 Class B, CE EN55032

5. Application Fields

  • IoT Development: Smart home sensor nodes
  • Industrial Automation: PLC expansion modules
  • Consumer Electronics: Prototype gaming controllers
  • Education: Robotics training platforms
  • Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
ArduinoArduino MKR Shield, Nano I/O Breakout
Raspberry PiPico W Expansion Board, HAT+ Prototyping
STMicroelectronicsST-Link/V2 Debugger, X-NUCLEO Expansion
Texas InstrumentsLaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization

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