Accessories

Image Part Number Description / PDF Quantity Rfq
R-78S3.3-0.1-EVM-1/SBL-1

R-78S3.3-0.1-EVM-1/SBL-1

RECOM Power

ACCESSORY FOR R-78S3.3-0.1-EVM-1

8

ADIS16IMU4/PCBZ

ADIS16IMU4/PCBZ

Analog Devices, Inc.

EVAL BOARD FOR ADIS16IMU4

7

EVAL-CHAMBER

EVAL-CHAMBER

Analog Devices, Inc.

SMOKE CHAMBER

92

112990086

112990086

Seeed

EMMC MODULE 16G FOR ROCK PI 4

0

GEN4-PA

GEN4-PA

4D Systems

PROGRAMMING ADAPTER FOR GEN4 INT

83

TMDXWL1271DC18XL1X

TMDXWL1271DC18XL1X

Texas Instruments

WL1271 DAUGHTER CARD

2

B-LCDAD-HDMI1

B-LCDAD-HDMI1

STMicroelectronics

DSI TO HDMI ADAPTER

53

110990092

110990092

Seeed

GROVE I2C BRANCH CABLES 5PACK

33

CGD12HB00D

CGD12HB00D

Wolfspeed - a Cree company

2CH DIFF TRANSCEIVER COMP TOOL

51

EHJ2C

EHJ2C

Advanced Linear Devices, Inc.

CABLE OUTBOUND W/CONN EH300/301

2

MIKROE-576

MIKROE-576

MikroElektronika

BOARD EASYPULL W/10K RESISTORS

0

ATSLCD1-XPRO

ATSLCD1-XPRO

Roving Networks / Microchip Technology

XPLAINED PRO SEGMENT LCD ADD-ON

2

B-STLINK-VOLT

B-STLINK-VOLT

STMicroelectronics

VOLTAGE ADAPTATION BOARD FOR STL

39

HW-LICENSE-DONGLE-USB-G

HW-LICENSE-DONGLE-USB-G

Xilinx

USB DONGLE ISE DESIGN SUITE

13

28216

28216

dresden elektronik

DERFTORCB ADAPTER

0

10114

10114

Phase Dock Inc.

2X3 ELECTRONICS MOUNTING CONNECT

25

STM32HSM-V2AE

STM32HSM-V2AE

STMicroelectronics

SAM FOR SECURE FIRMWARE INSTALLA

21

3893

3893

Adafruit

JST PH 3PIN TO MALE HEADER CABLE

254

CVM77M

CVM77M

TechTools

MEMBER MODULE PIC16C66/67/76/77

0

EVI-EM2COMIF

EVI-EM2COMIF

Intel

USB COMMUNICATIONS I/F DONGLE FO

27

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Interface CablesHigh-speed data transfer, hot-plugging supportUSB-UART converters, HDMI breakout cables
Power ModulesRegulated voltage output, battery managementLipo battery packs, DC-DC converters
Sensor ModulesDigital/analog signal acquisition, calibration-freeTemperature/humidity sensors, IMUs
Expansion BoardsPeripheral interface extension, protocol conversionMotor drivers, LoRaWAN shields
Debugging ToolsReal-time tracing, voltage measurementJTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

ParameterDescription
Interface CompatibilitySupports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling1.8V-24V input range, 5A max current
Signal Integrity12-bit ADC resolution (0.01% error), 1ns jitter
Environmental RatingOperating temp: -40 C to +85 C, IP54 dust/water resistance
EMC ComplianceFCC Part 15 Class B, CE EN55032

5. Application Fields

  • IoT Development: Smart home sensor nodes
  • Industrial Automation: PLC expansion modules
  • Consumer Electronics: Prototype gaming controllers
  • Education: Robotics training platforms
  • Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
ArduinoArduino MKR Shield, Nano I/O Breakout
Raspberry PiPico W Expansion Board, HAT+ Prototyping
STMicroelectronicsST-Link/V2 Debugger, X-NUCLEO Expansion
Texas InstrumentsLaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization

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