Accessories

Image Part Number Description / PDF Quantity Rfq
MIKROE-478

MIKROE-478

MikroElektronika

BOARD EASYBUZZ PIEZO SPEAKER

0

AC162088

AC162088

Roving Networks / Microchip Technology

HEADER MPLAB ICD2 24FJ64GA004 28

0

IMX233-OLINUXINO-SD

IMX233-OLINUXINO-SD

Olimex

SD CARD LOADED WITH LINUX

0

COM-14572

COM-14572

SparkFun

SMARTIPI TOUCH BACK COVER LARGE

3

10120

10120

Phase Dock Inc.

3X4 ELECTRONICS MOUNTING CONNECT

25

4D SERIAL PI ADAPTOR

4D SERIAL PI ADAPTOR

4D Systems

ADAPTER BOARD RASPBERRY PI

4

AC102016

AC102016

Roving Networks / Microchip Technology

MODULAR CABLE FOR MPLAB ICD 4

16

BTE17

BTE17

Macchina

M2 BREAKOUT BOARD

100

942

942

Adafruit

PI DISH FOR RASPBERRY

0

250-060

250-060

Digilent, Inc.

4 PIN TO 4 PIN 9INCH MTE CABLE

0

114020102

114020102

Seeed

GROVE RIVET 2.1MM DIA 30PACK

0

MA330052

MA330052

Roving Networks / Microchip Technology

DSPIC33CK64MC105 PIM MODULE

5

EVAL-FW-BPDF1

EVAL-FW-BPDF1

Analog Devices, Inc.

EVAL BOARD FW BPDF1

1

MA240017

MA240017

Roving Networks / Microchip Technology

MODULE PLUG-IN PIC24F16KA102 PIM

5

I3-TRACER1

I3-TRACER1

RF Solutions

BOARD ADD ON TRACE

3

ATADAPTEST

ATADAPTEST

Roving Networks / Microchip Technology

ADAPTER TEST ICE50

12

1663

1663

Adafruit

3-PIN JST SM PLUG/RECEPTACLE SET

0

SPY-BI-TAG

SPY-BI-TAG

Tag-Connect

ADAPTER TC2030-MCP 6PIN NO R1

0

DB756

DB756

RF Solutions

BOARD DAUGHTER ICEPIC2

2

HVPMSMMTR

HVPMSMMTR

Texas Instruments

MOTOR PERM MAGNET SYNCH

11

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Interface CablesHigh-speed data transfer, hot-plugging supportUSB-UART converters, HDMI breakout cables
Power ModulesRegulated voltage output, battery managementLipo battery packs, DC-DC converters
Sensor ModulesDigital/analog signal acquisition, calibration-freeTemperature/humidity sensors, IMUs
Expansion BoardsPeripheral interface extension, protocol conversionMotor drivers, LoRaWAN shields
Debugging ToolsReal-time tracing, voltage measurementJTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

ParameterDescription
Interface CompatibilitySupports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling1.8V-24V input range, 5A max current
Signal Integrity12-bit ADC resolution (0.01% error), 1ns jitter
Environmental RatingOperating temp: -40 C to +85 C, IP54 dust/water resistance
EMC ComplianceFCC Part 15 Class B, CE EN55032

5. Application Fields

  • IoT Development: Smart home sensor nodes
  • Industrial Automation: PLC expansion modules
  • Consumer Electronics: Prototype gaming controllers
  • Education: Robotics training platforms
  • Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
ArduinoArduino MKR Shield, Nano I/O Breakout
Raspberry PiPico W Expansion Board, HAT+ Prototyping
STMicroelectronicsST-Link/V2 Debugger, X-NUCLEO Expansion
Texas InstrumentsLaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization

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