Accessories

Part Number	Description / PDF	Quantity
TLK10002SMAEVM Texas Instruments	BOARD DAUGHTER SMA FOR TLK10002	3
AC162056 Roving Networks / Microchip Technology	HEADER INTERFACE ICD2 16F688	0
MA320021 Roving Networks / Microchip Technology	PIC32MX274F256D PIM FOR EXPLORER	6
BBEXPDTC70	LCD 7.0" CAP-TOUCH BEAGLE BONE	46
UMFT311GP Future Technology Devices International, Ltd.	GPIO SHIELD BOARD FOR FT311D	7
DS9097U-S09# Maxim Integrated	COM PORT ADAPTER	2931120
CY3096 IR (Infineon Technologies)	SOCKET ADAPTER FOR CY2071AF	0
8.06.02 J-LINK 9-PIN CORTEX-M ADAPTER Segger Microcontroller Systems	J-LINK 9-PIN CORTEX-M ADAPTER	550
ATBTLC1000-XPRO-ADPT Roving Networks / Microchip Technology	BTLC1000-XPRO EXT ADAPTER BOARD	6
SAD105-SF5C Amulet Technologies, LLC.	POWER SUPPLY	0
IOSHIELD_L WIZnet	IOSHIELD FOR TI'S LAUNCHPAD	1
CVM66XM TechTools	MEMBER MOD PIC16C641/642/661/662	0
CPI2-ISO Phyton, Inc.	OPTIONAL BOARD WITH GALVANIC ISO	0
310-014 Digilent, Inc.	1 X 6 PIN MTE CABLE	20
702 Adafruit	PROTO PLATE	1
EA-ACC-026 Embedded Artists	RIBBON CABLE IDC 24-POS 50MIL	0
201874 Watterott electronic	SILENTSTEPSTICK PROTECTOR FOR ST	63
240-038 Digilent, Inc.	SERVO BRACKET KIT PAIR	0
3955 Adafruit	JST PH 4-PIN TO MALE HEADER CABL	356
110990210 Seeed	GROVE 4PIN MALE JUMPERS 5PACK	441

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Interface Cables	High-speed data transfer, hot-plugging support	USB-UART converters, HDMI breakout cables
Power Modules	Regulated voltage output, battery management	Lipo battery packs, DC-DC converters
Sensor Modules	Digital/analog signal acquisition, calibration-free	Temperature/humidity sensors, IMUs
Expansion Boards	Peripheral interface extension, protocol conversion	Motor drivers, LoRaWAN shields
Debugging Tools	Real-time tracing, voltage measurement	JTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

Parameter	Description
Interface Compatibility	Supports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling	1.8V-24V input range, 5A max current
Signal Integrity	12-bit ADC resolution (0.01% error), 1ns jitter
Environmental Rating	Operating temp: -40 C to +85 C, IP54 dust/water resistance
EMC Compliance	FCC Part 15 Class B, CE EN55032

5. Application Fields

IoT Development: Smart home sensor nodes
Industrial Automation: PLC expansion modules
Consumer Electronics: Prototype gaming controllers
Education: Robotics training platforms
Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

Manufacturer	Representative Products
Arduino	Arduino MKR Shield, Nano I/O Breakout
Raspberry Pi	Pico W Expansion Board, HAT+ Prototyping
STMicroelectronics	ST-Link/V2 Debugger, X-NUCLEO Expansion
Texas Instruments	LaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization