Accessories

Image Part Number Description / PDF Quantity Rfq
DVA12XP081

DVA12XP081

Roving Networks / Microchip Technology

ADAPTER DEVICE FOR MPLAB-ICE

2

EHJ3C

EHJ3C

Advanced Linear Devices, Inc.

CABLE INPUT FOR EH42 MODULE

0

TC2030-CLIP

TC2030-CLIP

Tag-Connect

BOARD RETAINING FOR TC2030-NL

0

MIKROE-316

MIKROE-316

MikroElektronika

BOARD POTENTIOMETER

0

ATUSB-PCB-80146

ATUSB-PCB-80146

Roving Networks / Microchip Technology

USB BRIDGE BOARD

34

800-00060

800-00060

Parallax, Inc.

CABLE ASSY PARALLAX MOTHERBOARD

4

20-101-0431

20-101-0431

Digi

ENCLOSURE UNIBOX FOR BL2030

7

ATQT3-XPRO

ATQT3-XPRO

Roving Networks / Microchip Technology

EXTENSION BOARD QT3-XPRO

2

PRT-08272

PRT-08272

SparkFun

2MM 10PIN XBEE SOCKET

0

ATAVRONE-PSU

ATAVRONE-PSU

Roving Networks / Microchip Technology

AVRONE REPLACEMENT POWER SUPPLY

6

MA240021

MA240021

Roving Networks / Microchip Technology

MOD PLUG-IN PIC24FJ256GB210

6

MA240025-1

MA240025-1

Roving Networks / Microchip Technology

MOD PIM PIC24EP512GU810 GP

5

TMDSCM572X

TMDSCM572X

Texas Instruments

TMDSEVM572X CAMERA MODULE

11

PE014X07

PE014X07

Elprotronic

GANGPRO-ARM SPLITTER

21

STM8/128-D/RAIS

STM8/128-D/RAIS

STMicroelectronics

BOARD DAUGHTER FOR STM8S207/8

0

PTC04_SENSORS_MULTI_CALIBRATION_BOARD

PTC04_SENSORS_MULTI_CALIBRATION_BOARD

Melexis

PTC04 EXTENSION BOARD

0

PRT-14428

PRT-14428

SparkFun

QWIIC CABLE - 200MM

386

MIKROE-2519

MIKROE-2519

MikroElektronika

FFC FLAT CABLE 20-PIN

0

MIKROE-392

MIKROE-392

MikroElektronika

BOARD DISPL SER 7SEG 8DIGIT

0

4557

4557

Adafruit

DIN BRACKET RPI, BB, ARDUINO

31

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Interface CablesHigh-speed data transfer, hot-plugging supportUSB-UART converters, HDMI breakout cables
Power ModulesRegulated voltage output, battery managementLipo battery packs, DC-DC converters
Sensor ModulesDigital/analog signal acquisition, calibration-freeTemperature/humidity sensors, IMUs
Expansion BoardsPeripheral interface extension, protocol conversionMotor drivers, LoRaWAN shields
Debugging ToolsReal-time tracing, voltage measurementJTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

ParameterDescription
Interface CompatibilitySupports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling1.8V-24V input range, 5A max current
Signal Integrity12-bit ADC resolution (0.01% error), 1ns jitter
Environmental RatingOperating temp: -40 C to +85 C, IP54 dust/water resistance
EMC ComplianceFCC Part 15 Class B, CE EN55032

5. Application Fields

  • IoT Development: Smart home sensor nodes
  • Industrial Automation: PLC expansion modules
  • Consumer Electronics: Prototype gaming controllers
  • Education: Robotics training platforms
  • Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
ArduinoArduino MKR Shield, Nano I/O Breakout
Raspberry PiPico W Expansion Board, HAT+ Prototyping
STMicroelectronicsST-Link/V2 Debugger, X-NUCLEO Expansion
Texas InstrumentsLaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization

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