Accessories

Image Part Number Description / PDF Quantity Rfq
PIM454

PIM454

Pimoroni

SPI BREAKOUT GARDEN EXTENDER KIT

46

PRT-14425

PRT-14425

SparkFun

QWIIC CABLE - BREADBOARD JUMPER

613

LBEE0ZZ1WE-TEMP

LBEE0ZZ1WE-TEMP

TOKO / Murata

MICROSD TO M.2 ADAPTER FOR I.MX

0

ASR00017

ASR00017

TinyCircuits

45MM WHEEL

0

AS5XXX-EK-UCB

AS5XXX-EK-UCB

ams

EVAL KIT FOR AS5XXX

0

SEN-08733

SEN-08733

SparkFun

INFRARED SENSOR JUMPER WIRE 3POS

0

CVM77XM

CVM77XM

TechTools

MEMBER MODULE PIC16C773/774

3

AC1059

AC1059

Analog Devices, Inc.

SOCKET FOR MODEL AD210 IC

52

DVA16XP185

DVA16XP185

Roving Networks / Microchip Technology

ADAPTER DEVICE ICE 18DIP/SOIC

3

240-040

240-040

Digilent, Inc.

WHEEL KIT PAIR 2.56" DIA SPLINE

4

MA180015

MA180015

Roving Networks / Microchip Technology

MODULE PLUG-IN 18F87J10 FOR HPC

0

8.06.11 J-LINK 2MM ADAPTER

8.06.11 J-LINK 2MM ADAPTER

Segger Microcontroller Systems

ADAPTER J-LINK 2MM ADAPTER

6

CY3250-21X23QFN-POD

CY3250-21X23QFN-POD

PSOC POD FOR CY8C21X23 QFN

0

240-110

240-110

Digilent, Inc.

2X6 PIN SPLIT CABLE

0

ATADAPT2313

ATADAPT2313

Roving Networks / Microchip Technology

ADAPTER PERSON ICE50 TINY2313

24

WIG-17265

WIG-17265

SparkFun

8BITDO LITE BLUETOOTH GAMEPAD -

24

MIKROE-55

MIKROE-55

MikroElektronika

BOARD LCD 2X16

66

V2C-SDC-0347A

V2C-SDC-0347A

Keil (ARM)

USDCARD SPI ADAPTER FOR CORTEX-M

1

FIT0513

FIT0513

DFRobot

IIC/I2C/UART SENSOR CABLE 10PACK

1

FIT0552

FIT0552

DFRobot

STREAMING CABLE FOR LATTEPANDA

4

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Interface CablesHigh-speed data transfer, hot-plugging supportUSB-UART converters, HDMI breakout cables
Power ModulesRegulated voltage output, battery managementLipo battery packs, DC-DC converters
Sensor ModulesDigital/analog signal acquisition, calibration-freeTemperature/humidity sensors, IMUs
Expansion BoardsPeripheral interface extension, protocol conversionMotor drivers, LoRaWAN shields
Debugging ToolsReal-time tracing, voltage measurementJTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

ParameterDescription
Interface CompatibilitySupports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling1.8V-24V input range, 5A max current
Signal Integrity12-bit ADC resolution (0.01% error), 1ns jitter
Environmental RatingOperating temp: -40 C to +85 C, IP54 dust/water resistance
EMC ComplianceFCC Part 15 Class B, CE EN55032

5. Application Fields

  • IoT Development: Smart home sensor nodes
  • Industrial Automation: PLC expansion modules
  • Consumer Electronics: Prototype gaming controllers
  • Education: Robotics training platforms
  • Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
ArduinoArduino MKR Shield, Nano I/O Breakout
Raspberry PiPico W Expansion Board, HAT+ Prototyping
STMicroelectronicsST-Link/V2 Debugger, X-NUCLEO Expansion
Texas InstrumentsLaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization

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