Accessories

Image Part Number Description / PDF Quantity Rfq
MIKROE-575

MIKROE-575

MikroElektronika

BOARD EASYPULL W/1K RESISTORS

0

MX8XMIPI4CAM2

MX8XMIPI4CAM2

NXP Semiconductors

4 CAMERA BOARD MINISAS OV10635

12

64020

64020

Parallax, Inc.

P2 EDGE MODULE BREADBOARD

11

BATT-14AAAPACK

BATT-14AAAPACK

NXP Semiconductors

BATTERY PACK - 14 AAA CELLS

6

CY3250-21X23QFN

CY3250-21X23QFN

PSOC POD FOR CY8C21X23 QFN

0

HW-DMB-1-G

HW-DMB-1-G

Xilinx

CABLE PROGRAM ALVEO

13

250-059

250-059

Digilent, Inc.

USB CABLE A TO B

0

MA240023

MA240023

Roving Networks / Microchip Technology

MODULE PLUG-IN PIC24FJ1024GB610

6

ADS8-V1EBZ

ADS8-V1EBZ

Analog Devices, Inc.

FPGA BASED DATA CAPTURE KIT

6

FIT0689

FIT0689

DFRobot

GDL-LINE-10CM

0

BEAGLEBONE-LCDCAPE

BEAGLEBONE-LCDCAPE

LCD CAPE FOR BEAGLEBONE

36

EVAL-SDP-CH1Z

EVAL-SDP-CH1Z

Analog Devices, Inc.

BOARD EVAL SDP CH1Z

64

MA330025-1

MA330025-1

Roving Networks / Microchip Technology

MODULE PLUG-IN DSPIC33E 100TQFP

7

MA320019

MA320019

Roving Networks / Microchip Technology

MOD PIM PIC32MZ EF

14

SC0123

SC0123

Raspberry Pi

CGL 16MM, TELE-PHOTO LENS

44

PIM109

PIM109

Pimoroni

PICADE WIRING LOOM

0

EK-HDRS-D49RA

EK-HDRS-D49RA

Texas Instruments

BUNDLE HDRS/HOUSING TIVA C

12

6002-410-011

6002-410-011

Digilent, Inc.

MOTOR ADAPT FOR NI MYRIO

4

PA-SOF-D420-16/6

PA-SOF-D420-16/6

Logical Systems

ADAPTER 16 PIN .420" PLUG, 6/PKG

0

CY3211-28SOIC

CY3211-28SOIC

Cypress Semiconductor

KIT FLEX POD FOR CY8C29X 28-SOIC

0

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Interface CablesHigh-speed data transfer, hot-plugging supportUSB-UART converters, HDMI breakout cables
Power ModulesRegulated voltage output, battery managementLipo battery packs, DC-DC converters
Sensor ModulesDigital/analog signal acquisition, calibration-freeTemperature/humidity sensors, IMUs
Expansion BoardsPeripheral interface extension, protocol conversionMotor drivers, LoRaWAN shields
Debugging ToolsReal-time tracing, voltage measurementJTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

ParameterDescription
Interface CompatibilitySupports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling1.8V-24V input range, 5A max current
Signal Integrity12-bit ADC resolution (0.01% error), 1ns jitter
Environmental RatingOperating temp: -40 C to +85 C, IP54 dust/water resistance
EMC ComplianceFCC Part 15 Class B, CE EN55032

5. Application Fields

  • IoT Development: Smart home sensor nodes
  • Industrial Automation: PLC expansion modules
  • Consumer Electronics: Prototype gaming controllers
  • Education: Robotics training platforms
  • Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
ArduinoArduino MKR Shield, Nano I/O Breakout
Raspberry PiPico W Expansion Board, HAT+ Prototyping
STMicroelectronicsST-Link/V2 Debugger, X-NUCLEO Expansion
Texas InstrumentsLaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization

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