Accessories

Image Part Number Description / PDF Quantity Rfq
USB2ANY

USB2ANY

Texas Instruments

INTERFACE ADAPTER

118

PRT-14059

PRT-14059

SparkFun

SMARTIPI TOUCH

10

ESP-FACTORYTB2

ESP-FACTORYTB2

Espressif Systems

PRODUCTION TESTING BOARD WITH TW

16

TWR-LCD

TWR-LCD

NXP Semiconductors

LCD MODULE FOR TWR SYSTEM

5

310-024

310-024

Digilent, Inc.

COAXPOWER CABLE 2.1MM FEMALE

4

EVAL-ADUSB2EBUZ

EVAL-ADUSB2EBUZ

Analog Devices, Inc.

USBI BRD USB TO SPI/I2C UNIV

25

AC162079

AC162079

Roving Networks / Microchip Technology

HEADER MPLAB ICD2 18F85J90 64/80

0

310-054

310-054

Digilent, Inc.

CABLE USB A TO MINI B

0

MCIMXCAMERA1MP

MCIMXCAMERA1MP

NXP Semiconductors

OV10635 MIPI CAMERA

12

SC0004

SC0004

Raspberry Pi

CAMERA ADAPTER CABLE FFC 22W TO

970

PTC-04-DB-81106

PTC-04-DB-81106

Melexis

PTC04 DAUGHTERBOARD 81106

19

EQ-IOCON-3

EQ-IOCON-3

Equinox Technologies

MOD PPM3 CONN-3 I/O ATMEGA JTAG

0

AC164110

AC164110

Roving Networks / Microchip Technology

ADAPTER RJ-11 TO ICSP

421

ATQT6-XPRO

ATQT6-XPRO

Roving Networks / Microchip Technology

XPLAINED PRO EXTENSION

2

310-027

310-027

Digilent, Inc.

BLACK SPEAKER 4 OHM 5 WATT

0

RMH05-DK-XX-1.0

RMH05-DK-XX-1.0

ams

ROTARY MAGNETIC HOLDER

93

MA320211

MA320211

Roving Networks / Microchip Technology

PIC32MK MCM MOTOR CONTROL PIM

0

102990062

102990062

Seeed

LOGIC PIRATE

0

20-101-0616

20-101-0616

Digi

CARD A/D EXPANSION RN1200

5

CY3250-29XXXQFN-POD

CY3250-29XXXQFN-POD

IR (Infineon Technologies)

PSOC POD FOR CY8C29 QFN

0

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Interface CablesHigh-speed data transfer, hot-plugging supportUSB-UART converters, HDMI breakout cables
Power ModulesRegulated voltage output, battery managementLipo battery packs, DC-DC converters
Sensor ModulesDigital/analog signal acquisition, calibration-freeTemperature/humidity sensors, IMUs
Expansion BoardsPeripheral interface extension, protocol conversionMotor drivers, LoRaWAN shields
Debugging ToolsReal-time tracing, voltage measurementJTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

ParameterDescription
Interface CompatibilitySupports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling1.8V-24V input range, 5A max current
Signal Integrity12-bit ADC resolution (0.01% error), 1ns jitter
Environmental RatingOperating temp: -40 C to +85 C, IP54 dust/water resistance
EMC ComplianceFCC Part 15 Class B, CE EN55032

5. Application Fields

  • IoT Development: Smart home sensor nodes
  • Industrial Automation: PLC expansion modules
  • Consumer Electronics: Prototype gaming controllers
  • Education: Robotics training platforms
  • Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
ArduinoArduino MKR Shield, Nano I/O Breakout
Raspberry PiPico W Expansion Board, HAT+ Prototyping
STMicroelectronicsST-Link/V2 Debugger, X-NUCLEO Expansion
Texas InstrumentsLaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization

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