Rectangular Connectors - Headers, Receptacles, Female Sockets

Part Number	Description / PDF	Quantity
0022173092 Woodhead - Molex	CONN RCPT 9POS 0.1 GOLD PCB	2586
0009483115 Woodhead - Molex	CONN RCPT 11P 0.156 GOLD EDGE MT	4
0448120023 Woodhead - Molex	CONN RCPT 5POS 0.1 GOLD PCB	1834
0872640652 Woodhead - Molex	CONN RCPT 6P 0.079 GOLD PCB R/A	0
5031591200 Woodhead - Molex	CONN RCPT 12POS 0.059 TIN PCB	4413
0524181010 Woodhead - Molex	CONN RCPT 10P 0.079 TIN PCB R/A	1063
5024431470 Woodhead - Molex	CONN RCPT 14POS 0.079 TIN SMD	3655
0022162100 Woodhead - Molex	CONN RCPT 10P 0.1 GOLD EDGE MNT	0
2132271010 Woodhead - Molex	CLIK-MATE1.5 DRVT SMT AU0.1 ETP	0
0448120020 Woodhead - Molex	CONN RCPT 2POS 0.1 GOLD PCB	0
0447642002 Woodhead - Molex	CONN RCPT 20P 0.118 GOLD PCB R/A	0
0009481124 Woodhead - Molex	CONN RCPT 12P 0.156 TIN EDGE MNT	1100
0038001436 Woodhead - Molex	CONN RCPT 16POS 0.1 TIN PCB	1094
5025850870 Woodhead - Molex	CONN RCPT 8POS 0.059 TIN SMD R/A	0
0873401224 Woodhead - Molex	CONN RCPT 12POS 0.079 GOLD SMD	3140
5023820970 Woodhead - Molex	CONN RCPT 9POS 0.049 TIN SMD	6581
2132260610 Woodhead - Molex	CONN RECPT R/A SMC 6 POS	8934000
0448120002 Woodhead - Molex	CONN RCPT 2POS 0.1 TIN PCB	4214
5023860671 Woodhead - Molex	CONN RCPT 6P 0.049 GOLD SMD R/A	6575
5024430370 Woodhead - Molex	CONN RCPT 3POS 0.079 TIN SMD	2915

Rectangular Connectors - Headers, Receptacles, Female Sockets

1. Overview

Rectangular connectors are modular electrical components designed to establish reliable connections between PCBs (Printed Circuit Boards) or electronic systems. This category includes headers (male pins), receptacles (female contacts), and sockets, which enable signal/power transmission while maintaining mechanical stability. Their standardized designs and versatility make them critical in modern electronics, from consumer devices to industrial machinery.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Single-Row Headers	Linear arrangement of male pins	Arduino shields, sensor modules
Double-Row Headers	Dual-row pin configuration for higher density	Computer motherboards, industrial controllers
Right-Angle Receptacles	90 orientation for space-constrained designs	Compact medical devices, automotive sensors
Stacking Female Sockets	Vertical interconnection for multi-board systems	3D printer control stacks, test equipment

3. Structure and Components

Typical construction includes:

Contact Terminals: Phosphor bronze or beryllium copper with gold/tin plating for conductivity
Insulation Housing: Thermoplastic materials (e.g., LCP, Nylon 6/6) for dielectric strength
Retention Mechanism: Polarization keys and locking tabs to prevent misalignment
Mounting Options: Through-hole or surface-mount (SMT) configurations

4. Key Technical Specifications

Parameter	Value/Range	Importance
Current Rating	0.5A - 10A per contact	Determines power transmission capacity
Contact Resistance	5-20m	Affects signal integrity and thermal performance
Dielectric Strength	500V - 2500V AC	Ensures electrical safety and insulation reliability
Operating Temperature	-55 C to +125 C	Defines environmental tolerance
Mating Cycles	100 - 10,000 cycles	Indicates mechanical durability

5. Application Fields

Consumer Electronics: Smartphones, laptops, gaming consoles
Industrial Automation: PLCs, motor drives, sensor hubs
Telecommunications: 5G base stations, network routers
Medical Devices: Diagnostic equipment, patient monitors
Automotive: ECU connectors, ADAS sensors

6. Leading Manufacturers and Products

Manufacturer	Representative Product
TE Connectivity	MicroSpeed Rectangular Connectors
Molex	PicoBlade 0.8mm Headers
Amphenol	MICRO CONECTA Surface Mount Sockets
Samtec	QTRADE High-Speed Receptacles

7. Selection Guidelines

Key considerations:

Electrical requirements (current/voltage levels)
PCB space constraints and stacking needs
Environmental factors (temperature, vibration, moisture)
Cost-effectiveness vs. long-term reliability
Compliance with standards (IPC, RoHS, REACH)

Example: For automotive applications, prioritize connectors with high vibration resistance (e.g., TE Connectivity's AMPMODU series) and AEC-Q200 certification.

8. Industry Trends

Emerging directions include:

Miniaturization: Sub-1.0mm pitch connectors for wearable devices
High-speed capabilities: 10+ Gbps data rates for 5G infrastructure
Enhanced reliability: Hermetic sealing for aerospace applications
Modular designs: Tool-less hot-swap systems for data centers