Rectangular Connectors - Headers, Receptacles, Female Sockets

Part Number	Description / PDF	Quantity
0447641002 Woodhead - Molex	CONN RCPT 10P 0.118 GOLD PCB R/A	2103
0009483106 Woodhead - Molex	CONN RCPT 10POS 0.156 GOLD PCB	0
0873402024 Woodhead - Molex	CONN RCPT 20POS 0.079 GOLD SMD	857
0009484089 Woodhead - Molex	CONN RCPT 8POS 0.156 TIN PCB	226
0010101023 Woodhead - Molex	CONN RCPT 2POS 0.2 TIN PCB	210
5023861071 Woodhead - Molex	CONN RCPT 10P 0.049 GOLD SMD R/A	3232
0022142024 Woodhead - Molex	CONN RCPT 2POS 0.1 TIN PCB	99
0022173032 Woodhead - Molex	CONN RCPT 3POS 0.1 GOLD PCB	1083
0022162110 Woodhead - Molex	CONN RCPT 11P 0.1 GOLD EDGE MNT	0
0872644052 Woodhead - Molex	CONN RCPT 40P 0.079 GOLD PCB R/A	0
0022172102 Woodhead - Molex	CONN RCPT 10POS 0.1 GOLD PCB	0
0873400624 Woodhead - Molex	CONN RCPT 6POS 0.079 GOLD SMD	6319
5025840560 Woodhead - Molex	CONN RCPT 5POS 0.059 TIN SMD	0
0022022025 Woodhead - Molex	CONN RCPT 2POS 0.1 TIN PCB	1500
0015247063 Woodhead - Molex	CONN RCPT 6POS 0.165 GOLD PCB	2150
0447641203 Woodhead - Molex	CONN RCPT 12P 0.118 GOLD PCB R/A	0
5023821170 Woodhead - Molex	CONN RCPT 11POS 0.049 TIN SMD	1809
0872642452 Woodhead - Molex	CONN RCPT 24P 0.079 GOLD PCB R/A	0
0022022035 Woodhead - Molex	CONN RCPT 3POS 0.1 TIN PCB	368
5024940470 Woodhead - Molex	CONN RCPT 4POS 0.079 TIN SMD R/A	20

Rectangular Connectors - Headers, Receptacles, Female Sockets

1. Overview

Rectangular connectors are modular electrical components designed to establish reliable connections between PCBs (Printed Circuit Boards) or electronic systems. This category includes headers (male pins), receptacles (female contacts), and sockets, which enable signal/power transmission while maintaining mechanical stability. Their standardized designs and versatility make them critical in modern electronics, from consumer devices to industrial machinery.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Single-Row Headers	Linear arrangement of male pins	Arduino shields, sensor modules
Double-Row Headers	Dual-row pin configuration for higher density	Computer motherboards, industrial controllers
Right-Angle Receptacles	90 orientation for space-constrained designs	Compact medical devices, automotive sensors
Stacking Female Sockets	Vertical interconnection for multi-board systems	3D printer control stacks, test equipment

3. Structure and Components

Typical construction includes:

Contact Terminals: Phosphor bronze or beryllium copper with gold/tin plating for conductivity
Insulation Housing: Thermoplastic materials (e.g., LCP, Nylon 6/6) for dielectric strength
Retention Mechanism: Polarization keys and locking tabs to prevent misalignment
Mounting Options: Through-hole or surface-mount (SMT) configurations

4. Key Technical Specifications

Parameter	Value/Range	Importance
Current Rating	0.5A - 10A per contact	Determines power transmission capacity
Contact Resistance	5-20m	Affects signal integrity and thermal performance
Dielectric Strength	500V - 2500V AC	Ensures electrical safety and insulation reliability
Operating Temperature	-55 C to +125 C	Defines environmental tolerance
Mating Cycles	100 - 10,000 cycles	Indicates mechanical durability

5. Application Fields

Consumer Electronics: Smartphones, laptops, gaming consoles
Industrial Automation: PLCs, motor drives, sensor hubs
Telecommunications: 5G base stations, network routers
Medical Devices: Diagnostic equipment, patient monitors
Automotive: ECU connectors, ADAS sensors

6. Leading Manufacturers and Products

Manufacturer	Representative Product
TE Connectivity	MicroSpeed Rectangular Connectors
Molex	PicoBlade 0.8mm Headers
Amphenol	MICRO CONECTA Surface Mount Sockets
Samtec	QTRADE High-Speed Receptacles

7. Selection Guidelines

Key considerations:

Electrical requirements (current/voltage levels)
PCB space constraints and stacking needs
Environmental factors (temperature, vibration, moisture)
Cost-effectiveness vs. long-term reliability
Compliance with standards (IPC, RoHS, REACH)

Example: For automotive applications, prioritize connectors with high vibration resistance (e.g., TE Connectivity's AMPMODU series) and AEC-Q200 certification.

8. Industry Trends

Emerging directions include:

Miniaturization: Sub-1.0mm pitch connectors for wearable devices
High-speed capabilities: 10+ Gbps data rates for 5G infrastructure
Enhanced reliability: Hermetic sealing for aerospace applications
Modular designs: Tool-less hot-swap systems for data centers