Rectangular Connectors - Headers, Receptacles, Female Sockets

Image Part Number Description / PDF Quantity Rfq
5020462070

5020462070

Woodhead - Molex

CONN RCPT 20P 0.049 GOLD SMD R/A

12193

5023860371

5023860371

Woodhead - Molex

CONN RCPT 3P 0.049 GOLD SMD R/A

7946

0447690402

0447690402

Woodhead - Molex

CONN RCPT 4POS 0.118 GOLD PCB

1545

0022152126

0022152126

Woodhead - Molex

CONN RCPT 12POS 0.1 TIN EDGE MNT

1600

0022142144

0022142144

Woodhead - Molex

CONN RCPT 14POS 0.1 TIN PCB

1604

0872641652

0872641652

Woodhead - Molex

CONN RCPT 16P 0.079 GOLD PCB R/A

99

0009483026

0009483026

Woodhead - Molex

CONN RCPT 2POS 0.156 GOLD PCB

1403

0432550123

0432550123

Woodhead - Molex

CONN HDR 3POS 0.25 TIN PCB

0

0447640601

0447640601

Woodhead - Molex

CONN RCPT 6POS 0.118 TIN PCB R/A

409

0009483126

0009483126

Woodhead - Molex

CONN RCPT 12POS 0.156 GOLD PCB

15

0872640852

0872640852

Woodhead - Molex

CONN RCPT 8P 0.079 GOLD PCB R/A

23

0524180810

0524180810

Woodhead - Molex

CONN RCPT 8POS 0.079 TIN PCB R/A

13941

0009484128

0009484128

Woodhead - Molex

CONN RCPT 12POS 0.156 TIN PCB

1155

0022027083

0022027083

Woodhead - Molex

CONN RCPT 8POS 0.1 TIN PCB

79

0901471115

0901471115

Woodhead - Molex

CONN RCPT 15POS 0.1 TIN PCB

266

0009483076

0009483076

Woodhead - Molex

CONN RCPT 7POS 0.156 GOLD PCB

815

5025841060

5025841060

Woodhead - Molex

CONN RCPT 10POS 0.059 TIN SMD

3091

5024430470

5024430470

Woodhead - Molex

CONN RCPT 4POS 0.079 TIN SMD

5272

0015247163

0015247163

Woodhead - Molex

CONN RCPT 16POS 0.165 GOLD PCB

0

0022142114

0022142114

Woodhead - Molex

CONN RCPT 11POS 0.1 TIN PCB

95

Rectangular Connectors - Headers, Receptacles, Female Sockets

1. Overview

Rectangular connectors are modular electrical components designed to establish reliable connections between PCBs (Printed Circuit Boards) or electronic systems. This category includes headers (male pins), receptacles (female contacts), and sockets, which enable signal/power transmission while maintaining mechanical stability. Their standardized designs and versatility make them critical in modern electronics, from consumer devices to industrial machinery.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Single-Row HeadersLinear arrangement of male pinsArduino shields, sensor modules
Double-Row HeadersDual-row pin configuration for higher densityComputer motherboards, industrial controllers
Right-Angle Receptacles90 orientation for space-constrained designsCompact medical devices, automotive sensors
Stacking Female SocketsVertical interconnection for multi-board systems3D printer control stacks, test equipment

3. Structure and Components

Typical construction includes:

  • Contact Terminals: Phosphor bronze or beryllium copper with gold/tin plating for conductivity
  • Insulation Housing: Thermoplastic materials (e.g., LCP, Nylon 6/6) for dielectric strength
  • Retention Mechanism: Polarization keys and locking tabs to prevent misalignment
  • Mounting Options: Through-hole or surface-mount (SMT) configurations

4. Key Technical Specifications

ParameterValue/RangeImportance
Current Rating0.5A - 10A per contactDetermines power transmission capacity
Contact Resistance5-20m Affects signal integrity and thermal performance
Dielectric Strength500V - 2500V ACEnsures electrical safety and insulation reliability
Operating Temperature-55 C to +125 CDefines environmental tolerance
Mating Cycles100 - 10,000 cyclesIndicates mechanical durability

5. Application Fields

  • Consumer Electronics: Smartphones, laptops, gaming consoles
  • Industrial Automation: PLCs, motor drives, sensor hubs
  • Telecommunications: 5G base stations, network routers
  • Medical Devices: Diagnostic equipment, patient monitors
  • Automotive: ECU connectors, ADAS sensors

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
TE ConnectivityMicroSpeed Rectangular Connectors
MolexPicoBlade 0.8mm Headers
AmphenolMICRO CONECTA Surface Mount Sockets
SamtecQTRADE High-Speed Receptacles

7. Selection Guidelines

Key considerations:

  • Electrical requirements (current/voltage levels)
  • PCB space constraints and stacking needs
  • Environmental factors (temperature, vibration, moisture)
  • Cost-effectiveness vs. long-term reliability
  • Compliance with standards (IPC, RoHS, REACH)

Example: For automotive applications, prioritize connectors with high vibration resistance (e.g., TE Connectivity's AMPMODU series) and AEC-Q200 certification.

8. Industry Trends

Emerging directions include:

  • Miniaturization: Sub-1.0mm pitch connectors for wearable devices
  • High-speed capabilities: 10+ Gbps data rates for 5G infrastructure
  • Enhanced reliability: Hermetic sealing for aerospace applications
  • Modular designs: Tool-less hot-swap systems for data centers
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