Rectangular Connectors - Headers, Receptacles, Female Sockets

Part Number	Description / PDF	Quantity
0022182091 Woodhead - Molex	CONN RCPT 9POS 0.1 GOLD PCB	850
5025840370 Woodhead - Molex	CONN RCPT 3POS 0.059 TIN SMD	8122
0447692403 Woodhead - Molex	CONN RCPT 24POS 0.118 GOLD PCB	0
0872643852 Woodhead - Molex	CONN RCPT 38P 0.079 GOLD PCB R/A	0
0447690801 Woodhead - Molex	CONN RCPT 8POS 0.118 TIN PCB	0
0015247062 Woodhead - Molex	CONN RCPT 6POS 0.165 GOLD PCB	0
0873683824 Woodhead - Molex	CONN RCPT 38P 0.079 GOLD SMD R/A	41
0781201207 Woodhead - Molex	CONN RCPT 12POS 0.05 GOLD SMD	1842
0901471106 Woodhead - Molex	CONN RCPT 6POS 0.1 TIN PCB	2456
0009484049 Woodhead - Molex	CONN RCPT 4POS 0.156 TIN PCB	707
0901481105 Woodhead - Molex	CONN RCPT 5POS 0.1 TIN PCB R/A	6115
5054062060 Woodhead - Molex	CONN RCPT 20POS 0.059 GOLD SMD	490
5023860770 Woodhead - Molex	CONN RCPT 7POS 0.049 TIN SMD R/A	2517
5031542690 Woodhead - Molex	CONN RCPT 26POS 0.059 TIN SMD	1304
0009483124 Woodhead - Molex	CONN RCPT 12POS 0.156 GOLD PCB	0
0901512120 Woodhead - Molex	CONN RCPT 20POS 0.1 TIN PCB	1431
0873682624 Woodhead - Molex	CONN RCPT 26P 0.079 GOLD SMD R/A	0
0432550035 Woodhead - Molex	CONN HDR 9POS 0.25 TIN PCB	454
0901471110 Woodhead - Molex	CONN RCPT 10POS 0.1 TIN PCB	2053
0901471206 Woodhead - Molex	CONN RCPT 6POS 0.1 GOLD PCB	6400

Rectangular Connectors - Headers, Receptacles, Female Sockets

1. Overview

Rectangular connectors are modular electrical components designed to establish reliable connections between PCBs (Printed Circuit Boards) or electronic systems. This category includes headers (male pins), receptacles (female contacts), and sockets, which enable signal/power transmission while maintaining mechanical stability. Their standardized designs and versatility make them critical in modern electronics, from consumer devices to industrial machinery.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Single-Row Headers	Linear arrangement of male pins	Arduino shields, sensor modules
Double-Row Headers	Dual-row pin configuration for higher density	Computer motherboards, industrial controllers
Right-Angle Receptacles	90 orientation for space-constrained designs	Compact medical devices, automotive sensors
Stacking Female Sockets	Vertical interconnection for multi-board systems	3D printer control stacks, test equipment

3. Structure and Components

Typical construction includes:

Contact Terminals: Phosphor bronze or beryllium copper with gold/tin plating for conductivity
Insulation Housing: Thermoplastic materials (e.g., LCP, Nylon 6/6) for dielectric strength
Retention Mechanism: Polarization keys and locking tabs to prevent misalignment
Mounting Options: Through-hole or surface-mount (SMT) configurations

4. Key Technical Specifications

Parameter	Value/Range	Importance
Current Rating	0.5A - 10A per contact	Determines power transmission capacity
Contact Resistance	5-20m	Affects signal integrity and thermal performance
Dielectric Strength	500V - 2500V AC	Ensures electrical safety and insulation reliability
Operating Temperature	-55 C to +125 C	Defines environmental tolerance
Mating Cycles	100 - 10,000 cycles	Indicates mechanical durability

5. Application Fields

Consumer Electronics: Smartphones, laptops, gaming consoles
Industrial Automation: PLCs, motor drives, sensor hubs
Telecommunications: 5G base stations, network routers
Medical Devices: Diagnostic equipment, patient monitors
Automotive: ECU connectors, ADAS sensors

6. Leading Manufacturers and Products

Manufacturer	Representative Product
TE Connectivity	MicroSpeed Rectangular Connectors
Molex	PicoBlade 0.8mm Headers
Amphenol	MICRO CONECTA Surface Mount Sockets
Samtec	QTRADE High-Speed Receptacles

7. Selection Guidelines

Key considerations:

Electrical requirements (current/voltage levels)
PCB space constraints and stacking needs
Environmental factors (temperature, vibration, moisture)
Cost-effectiveness vs. long-term reliability
Compliance with standards (IPC, RoHS, REACH)

Example: For automotive applications, prioritize connectors with high vibration resistance (e.g., TE Connectivity's AMPMODU series) and AEC-Q200 certification.

8. Industry Trends

Emerging directions include:

Miniaturization: Sub-1.0mm pitch connectors for wearable devices
High-speed capabilities: 10+ Gbps data rates for 5G infrastructure
Enhanced reliability: Hermetic sealing for aerospace applications
Modular designs: Tool-less hot-swap systems for data centers