Rectangular Connectors - Headers, Receptacles, Female Sockets

Part Number	Description / PDF	Quantity
0009483125 Woodhead - Molex	CONN RCPT 12P 0.156 GOLD EDGE MT	640
5054050670 Woodhead - Molex	CONN RCPT 6POS 0.059 GOLD SMD	2423
0015247143 Woodhead - Molex	CONN RCPT 14POS 0.165 GOLD PCB	0
5023821470 Woodhead - Molex	CONN RCPT 14POS 0.049 TIN SMD	3134
0448120011 Woodhead - Molex	CONN RCPT 11POS 0.1 TIN PCB	0
0022173162 Woodhead - Molex	CONN RCPT 16POS 0.1 GOLD PCB	0
5031590800 Woodhead - Molex	CONN RCPT 8POS 0.059 TIN PCB	0
0791077134 Woodhead - Molex	CONN RCPT 20POS 0.079 GOLD PCB	0
5031750300 Woodhead - Molex	CONN RCPT 3POS 0.059 TIN PCB R/A	5807
5023821070 Woodhead - Molex	CONN RCPT 10POS 0.049 TIN SMD	4807
0022152036 Woodhead - Molex	CONN RCPT 3POS 0.1 TIN EDGE MNT	10771
0010101031 Woodhead - Molex	CONN RCPT 3POS 0.2 TIN EDGE MNT	120
0447641801 Woodhead - Molex	CONN RCPT 18P 0.118 TIN PCB R/A	0
0009484029 Woodhead - Molex	CONN RCPT 2POS 0.156 TIN PCB	941
5031543090 Woodhead - Molex	CONN RCPT 30POS 0.059 TIN SMD	1404
0901481102 Woodhead - Molex	CONN RCPT 2POS 0.1 TIN PCB R/A	1625
5024940270 Woodhead - Molex	CONN RCPT 2POS 0.079 TIN SMD R/A	0
0524180410 Woodhead - Molex	CONN RCPT 4POS 0.079 TIN PCB R/A	7837
0022162030 Woodhead - Molex	CONN RCPT 3POS 0.1 GOLD EDGE MNT	1833
0447691803 Woodhead - Molex	CONN RCPT 18POS 0.118 GOLD PCB	0

Rectangular Connectors - Headers, Receptacles, Female Sockets

1. Overview

Rectangular connectors are modular electrical components designed to establish reliable connections between PCBs (Printed Circuit Boards) or electronic systems. This category includes headers (male pins), receptacles (female contacts), and sockets, which enable signal/power transmission while maintaining mechanical stability. Their standardized designs and versatility make them critical in modern electronics, from consumer devices to industrial machinery.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Single-Row Headers	Linear arrangement of male pins	Arduino shields, sensor modules
Double-Row Headers	Dual-row pin configuration for higher density	Computer motherboards, industrial controllers
Right-Angle Receptacles	90 orientation for space-constrained designs	Compact medical devices, automotive sensors
Stacking Female Sockets	Vertical interconnection for multi-board systems	3D printer control stacks, test equipment

3. Structure and Components

Typical construction includes:

Contact Terminals: Phosphor bronze or beryllium copper with gold/tin plating for conductivity
Insulation Housing: Thermoplastic materials (e.g., LCP, Nylon 6/6) for dielectric strength
Retention Mechanism: Polarization keys and locking tabs to prevent misalignment
Mounting Options: Through-hole or surface-mount (SMT) configurations

4. Key Technical Specifications

Parameter	Value/Range	Importance
Current Rating	0.5A - 10A per contact	Determines power transmission capacity
Contact Resistance	5-20m	Affects signal integrity and thermal performance
Dielectric Strength	500V - 2500V AC	Ensures electrical safety and insulation reliability
Operating Temperature	-55 C to +125 C	Defines environmental tolerance
Mating Cycles	100 - 10,000 cycles	Indicates mechanical durability

5. Application Fields

Consumer Electronics: Smartphones, laptops, gaming consoles
Industrial Automation: PLCs, motor drives, sensor hubs
Telecommunications: 5G base stations, network routers
Medical Devices: Diagnostic equipment, patient monitors
Automotive: ECU connectors, ADAS sensors

6. Leading Manufacturers and Products

Manufacturer	Representative Product
TE Connectivity	MicroSpeed Rectangular Connectors
Molex	PicoBlade 0.8mm Headers
Amphenol	MICRO CONECTA Surface Mount Sockets
Samtec	QTRADE High-Speed Receptacles

7. Selection Guidelines

Key considerations:

Electrical requirements (current/voltage levels)
PCB space constraints and stacking needs
Environmental factors (temperature, vibration, moisture)
Cost-effectiveness vs. long-term reliability
Compliance with standards (IPC, RoHS, REACH)

Example: For automotive applications, prioritize connectors with high vibration resistance (e.g., TE Connectivity's AMPMODU series) and AEC-Q200 certification.

8. Industry Trends

Emerging directions include:

Miniaturization: Sub-1.0mm pitch connectors for wearable devices
High-speed capabilities: 10+ Gbps data rates for 5G infrastructure
Enhanced reliability: Hermetic sealing for aerospace applications
Modular designs: Tool-less hot-swap systems for data centers