Rectangular Connectors - Headers, Receptacles, Female Sockets

Part Number	Description / PDF	Quantity
0022022125 Woodhead - Molex	CONN RCPT 12POS 0.1 TIN PCB	1141
0010101103 Woodhead - Molex	CONN RCPT 10POS 0.2 TIN PCB	49
5033950310 Woodhead - Molex	CONN RCPT 3POS 0.059 TIN SMD	4035
0791077015 Woodhead - Molex	CONN RCPT 32POS 0.079 GOLD PCB	2530
5031540890 Woodhead - Molex	CONN RCPT 8POS 0.059 TIN SMD	3
5031590400 Woodhead - Molex	CONN RCPT 4POS 0.059 TIN PCB	1149
0791091008 Woodhead - Molex	CONN RCPT 18POS 0.079 GOLD SMD	3707
5024940870 Woodhead - Molex	CONN RCPT 8POS 0.079 TIN SMD R/A	2314
5025840270 Woodhead - Molex	CONN RCPT 2POS 0.059 TIN SMD	50
0791077002 Woodhead - Molex	CONN RCPT 6POS 0.079 GOLD PCB	4395
0873819016 Woodhead - Molex	CONN RCPT 8POS 0.079 GOLD SMD	3980
0009484048 Woodhead - Molex	CONN RCPT 4POS 0.156 TIN PCB	3755
0015247182 Woodhead - Molex	CONN RCPT 18POS 0.165 GOLD PCB	0
0009484119 Woodhead - Molex	CONN RCPT 11POS 0.156 TIN PCB	0
0872644252 Woodhead - Molex	CONN RCPT 42P 0.079 GOLD PCB R/A	0
0009483054 Woodhead - Molex	CONN RCPT 5POS 0.156 GOLD PCB	6
0010845021 Woodhead - Molex	CONN HDR 2POS 0.25 TIN PCB	1257
0009481054 Woodhead - Molex	CONN RCPT 5P 0.156 TIN EDGE MNT	907
5031542090 Woodhead - Molex	CONN RCPT 20POS 0.059 TIN SMD	2883
0009484099 Woodhead - Molex	CONN RCPT 9POS 0.156 TIN PCB	0

Rectangular Connectors - Headers, Receptacles, Female Sockets

1. Overview

Rectangular connectors are modular electrical components designed to establish reliable connections between PCBs (Printed Circuit Boards) or electronic systems. This category includes headers (male pins), receptacles (female contacts), and sockets, which enable signal/power transmission while maintaining mechanical stability. Their standardized designs and versatility make them critical in modern electronics, from consumer devices to industrial machinery.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Single-Row Headers	Linear arrangement of male pins	Arduino shields, sensor modules
Double-Row Headers	Dual-row pin configuration for higher density	Computer motherboards, industrial controllers
Right-Angle Receptacles	90 orientation for space-constrained designs	Compact medical devices, automotive sensors
Stacking Female Sockets	Vertical interconnection for multi-board systems	3D printer control stacks, test equipment

3. Structure and Components

Typical construction includes:

Contact Terminals: Phosphor bronze or beryllium copper with gold/tin plating for conductivity
Insulation Housing: Thermoplastic materials (e.g., LCP, Nylon 6/6) for dielectric strength
Retention Mechanism: Polarization keys and locking tabs to prevent misalignment
Mounting Options: Through-hole or surface-mount (SMT) configurations

4. Key Technical Specifications

Parameter	Value/Range	Importance
Current Rating	0.5A - 10A per contact	Determines power transmission capacity
Contact Resistance	5-20m	Affects signal integrity and thermal performance
Dielectric Strength	500V - 2500V AC	Ensures electrical safety and insulation reliability
Operating Temperature	-55 C to +125 C	Defines environmental tolerance
Mating Cycles	100 - 10,000 cycles	Indicates mechanical durability

5. Application Fields

Consumer Electronics: Smartphones, laptops, gaming consoles
Industrial Automation: PLCs, motor drives, sensor hubs
Telecommunications: 5G base stations, network routers
Medical Devices: Diagnostic equipment, patient monitors
Automotive: ECU connectors, ADAS sensors

6. Leading Manufacturers and Products

Manufacturer	Representative Product
TE Connectivity	MicroSpeed Rectangular Connectors
Molex	PicoBlade 0.8mm Headers
Amphenol	MICRO CONECTA Surface Mount Sockets
Samtec	QTRADE High-Speed Receptacles

7. Selection Guidelines

Key considerations:

Electrical requirements (current/voltage levels)
PCB space constraints and stacking needs
Environmental factors (temperature, vibration, moisture)
Cost-effectiveness vs. long-term reliability
Compliance with standards (IPC, RoHS, REACH)

Example: For automotive applications, prioritize connectors with high vibration resistance (e.g., TE Connectivity's AMPMODU series) and AEC-Q200 certification.

8. Industry Trends

Emerging directions include:

Miniaturization: Sub-1.0mm pitch connectors for wearable devices
High-speed capabilities: 10+ Gbps data rates for 5G infrastructure
Enhanced reliability: Hermetic sealing for aerospace applications
Modular designs: Tool-less hot-swap systems for data centers