Rectangular Connectors - Headers, Receptacles, Female Sockets

Part Number	Description / PDF	Quantity
0447692002 Woodhead - Molex	CONN RCPT 20POS 0.118 GOLD PCB	0
0447641402 Woodhead - Molex	CONN RCPT 14P 0.118 GOLD PCB R/A	120
0873400824 Woodhead - Molex	CONN RCPT 8POS 0.079 GOLD SMD	2646
0038001340 Woodhead - Molex	CONN RCPT 10POS 0.1 TIN EDGE MNT	0
5024431570 Woodhead - Molex	CONN RCPT 15POS 0.079 TIN SMD	167
0872644452 Woodhead - Molex	CONN RCPT 44P 0.079 GOLD PCB R/A	1188
0367570143 Woodhead - Molex	CONN HDR 4POS 0.25 TIN PCB	0
0873683624 Woodhead - Molex	CONN RCPT 36P 0.079 GOLD SMD R/A	0
5054061260 Woodhead - Molex	CONN RCPT 12POS 0.059 GOLD SMD	1992
0009483074 Woodhead - Molex	CONN RCPT 7POS 0.156 GOLD PCB	0
0009481064 Woodhead - Molex	CONN RCPT 6P 0.156 TIN EDGE MNT	1329
0447641201 Woodhead - Molex	CONN RCPT 12P 0.118 TIN PCB R/A	3413
0447640802 Woodhead - Molex	CONN RCPT 8P 0.118 GOLD PCB R/A	1113
0022152026 Woodhead - Molex	CONN RCPT 2POS 0.1 TIN EDGE MNT	2861
0009481094 Woodhead - Molex	CONN RCPT 9P 0.156 TIN EDGE MNT	2225
0448120007 Woodhead - Molex	CONN RCPT 7POS 0.1 TIN PCB	0
5020463070 Woodhead - Molex	CONN RCPT 30P 0.049 GOLD SMD R/A	20708
5054062460 Woodhead - Molex	CONN RCPT 24POS 0.059 GOLD SMD	285
5033951010 Woodhead - Molex	CONN RCPT 10POS 0.059 TIN SMD	1688
0009484058 Woodhead - Molex	CONN RCPT 5POS 0.156 TIN PCB	79

Rectangular Connectors - Headers, Receptacles, Female Sockets

1. Overview

Rectangular connectors are modular electrical components designed to establish reliable connections between PCBs (Printed Circuit Boards) or electronic systems. This category includes headers (male pins), receptacles (female contacts), and sockets, which enable signal/power transmission while maintaining mechanical stability. Their standardized designs and versatility make them critical in modern electronics, from consumer devices to industrial machinery.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Single-Row Headers	Linear arrangement of male pins	Arduino shields, sensor modules
Double-Row Headers	Dual-row pin configuration for higher density	Computer motherboards, industrial controllers
Right-Angle Receptacles	90 orientation for space-constrained designs	Compact medical devices, automotive sensors
Stacking Female Sockets	Vertical interconnection for multi-board systems	3D printer control stacks, test equipment

3. Structure and Components

Typical construction includes:

Contact Terminals: Phosphor bronze or beryllium copper with gold/tin plating for conductivity
Insulation Housing: Thermoplastic materials (e.g., LCP, Nylon 6/6) for dielectric strength
Retention Mechanism: Polarization keys and locking tabs to prevent misalignment
Mounting Options: Through-hole or surface-mount (SMT) configurations

4. Key Technical Specifications

Parameter	Value/Range	Importance
Current Rating	0.5A - 10A per contact	Determines power transmission capacity
Contact Resistance	5-20m	Affects signal integrity and thermal performance
Dielectric Strength	500V - 2500V AC	Ensures electrical safety and insulation reliability
Operating Temperature	-55 C to +125 C	Defines environmental tolerance
Mating Cycles	100 - 10,000 cycles	Indicates mechanical durability

5. Application Fields

Consumer Electronics: Smartphones, laptops, gaming consoles
Industrial Automation: PLCs, motor drives, sensor hubs
Telecommunications: 5G base stations, network routers
Medical Devices: Diagnostic equipment, patient monitors
Automotive: ECU connectors, ADAS sensors

6. Leading Manufacturers and Products

Manufacturer	Representative Product
TE Connectivity	MicroSpeed Rectangular Connectors
Molex	PicoBlade 0.8mm Headers
Amphenol	MICRO CONECTA Surface Mount Sockets
Samtec	QTRADE High-Speed Receptacles

7. Selection Guidelines

Key considerations:

Electrical requirements (current/voltage levels)
PCB space constraints and stacking needs
Environmental factors (temperature, vibration, moisture)
Cost-effectiveness vs. long-term reliability
Compliance with standards (IPC, RoHS, REACH)

Example: For automotive applications, prioritize connectors with high vibration resistance (e.g., TE Connectivity's AMPMODU series) and AEC-Q200 certification.

8. Industry Trends

Emerging directions include:

Miniaturization: Sub-1.0mm pitch connectors for wearable devices
High-speed capabilities: 10+ Gbps data rates for 5G infrastructure
Enhanced reliability: Hermetic sealing for aerospace applications
Modular designs: Tool-less hot-swap systems for data centers