Rectangular Connectors - Headers, Receptacles, Female Sockets

Part Number	Description / PDF	Quantity
0015247243 Woodhead - Molex	CONN RCPT 24POS 0.165 GOLD PCB	554
2132272411 Woodhead - Molex	CLIK-MATE1.5 DRVT SMT AU0.1 ETP	0
0022182031 Woodhead - Molex	CONN RCPT 3POS 0.1 GOLD PCB	665
0447641003 Woodhead - Molex	CONN RCPT 10P 0.118 GOLD PCB R/A	0
5031542290 Woodhead - Molex	CONN RCPT 22POS 0.059 TIN SMD	1193
0432550139 Woodhead - Molex	CONN HDR 6POS 0.25 TIN PCB	1236
0022152086 Woodhead - Molex	CONN RCPT 8POS 0.1 TIN EDGE MNT	1262
2132273210 Woodhead - Molex	CLIK-MATE1.5 DRVT SMT AU0.1 ETP	0
0901522140 Woodhead - Molex	CONN RCPT 40POS 0.1 TIN PCB R/A	187
0022182081 Woodhead - Molex	CONN RCPT 8POS 0.1 GOLD PCB	2659
0447691601 Woodhead - Molex	CONN RCPT 16POS 0.118 TIN PCB	1461
0873682824 Woodhead - Molex	CONN RCPT 28P 0.079 GOLD SMD R/A	0
0447691202 Woodhead - Molex	CONN RCPT 12POS 0.118 GOLD PCB	824
0022022105 Woodhead - Molex	CONN RCPT 10POS 0.1 TIN PCB	0
0447642203 Woodhead - Molex	CONN RCPT 22P 0.118 GOLD PCB R/A	0
0791091003 Woodhead - Molex	CONN RCPT 8POS 0.079 GOLD SMD	11854
0901512210 Woodhead - Molex	CONN RCPT 10POS 0.1 GOLD PCB	3559
5024940670 Woodhead - Molex	CONN RCPT 6POS 0.079 TIN SMD R/A	0
5025850370 Woodhead - Molex	CONN RCPT 3POS 0.059 TIN SMD R/A	15567
2132250410 Woodhead - Molex	CONN RECPT VERT SMC 4 POS	692

Rectangular Connectors - Headers, Receptacles, Female Sockets

1. Overview

Rectangular connectors are modular electrical components designed to establish reliable connections between PCBs (Printed Circuit Boards) or electronic systems. This category includes headers (male pins), receptacles (female contacts), and sockets, which enable signal/power transmission while maintaining mechanical stability. Their standardized designs and versatility make them critical in modern electronics, from consumer devices to industrial machinery.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Single-Row Headers	Linear arrangement of male pins	Arduino shields, sensor modules
Double-Row Headers	Dual-row pin configuration for higher density	Computer motherboards, industrial controllers
Right-Angle Receptacles	90 orientation for space-constrained designs	Compact medical devices, automotive sensors
Stacking Female Sockets	Vertical interconnection for multi-board systems	3D printer control stacks, test equipment

3. Structure and Components

Typical construction includes:

Contact Terminals: Phosphor bronze or beryllium copper with gold/tin plating for conductivity
Insulation Housing: Thermoplastic materials (e.g., LCP, Nylon 6/6) for dielectric strength
Retention Mechanism: Polarization keys and locking tabs to prevent misalignment
Mounting Options: Through-hole or surface-mount (SMT) configurations

4. Key Technical Specifications

Parameter	Value/Range	Importance
Current Rating	0.5A - 10A per contact	Determines power transmission capacity
Contact Resistance	5-20m	Affects signal integrity and thermal performance
Dielectric Strength	500V - 2500V AC	Ensures electrical safety and insulation reliability
Operating Temperature	-55 C to +125 C	Defines environmental tolerance
Mating Cycles	100 - 10,000 cycles	Indicates mechanical durability

5. Application Fields

Consumer Electronics: Smartphones, laptops, gaming consoles
Industrial Automation: PLCs, motor drives, sensor hubs
Telecommunications: 5G base stations, network routers
Medical Devices: Diagnostic equipment, patient monitors
Automotive: ECU connectors, ADAS sensors

6. Leading Manufacturers and Products

Manufacturer	Representative Product
TE Connectivity	MicroSpeed Rectangular Connectors
Molex	PicoBlade 0.8mm Headers
Amphenol	MICRO CONECTA Surface Mount Sockets
Samtec	QTRADE High-Speed Receptacles

7. Selection Guidelines

Key considerations:

Electrical requirements (current/voltage levels)
PCB space constraints and stacking needs
Environmental factors (temperature, vibration, moisture)
Cost-effectiveness vs. long-term reliability
Compliance with standards (IPC, RoHS, REACH)

Example: For automotive applications, prioritize connectors with high vibration resistance (e.g., TE Connectivity's AMPMODU series) and AEC-Q200 certification.

8. Industry Trends

Emerging directions include:

Miniaturization: Sub-1.0mm pitch connectors for wearable devices
High-speed capabilities: 10+ Gbps data rates for 5G infrastructure
Enhanced reliability: Hermetic sealing for aerospace applications
Modular designs: Tool-less hot-swap systems for data centers