Rectangular Connectors - Headers, Receptacles, Female Sockets

Image Part Number Description / PDF Quantity Rfq
0009483036

0009483036

Woodhead - Molex

CONN RCPT 3POS 0.156 GOLD PCB

42

0447691003

0447691003

Woodhead - Molex

CONN RCPT 10POS 0.118 GOLD PCB

0

0432550131

0432550131

Woodhead - Molex

CONN HDR 4POS 0.25 TIN PCB

0

0901512116

0901512116

Woodhead - Molex

CONN RCPT 16POS 0.1 TIN PCB

0

0038001424

0038001424

Woodhead - Molex

CONN RCPT 4POS 0.1 TIN PCB

45

5023820672

5023820672

Woodhead - Molex

CONN RCPT 6POS 0.049 TIN SMD

5327

0022162070

0022162070

Woodhead - Molex

CONN RCPT 7POS 0.1 GOLD EDGE MNT

192

0015445110

0015445110

Woodhead - Molex

CONN RCPT 10POS 0.1 GOLD PCB

0

0010101081

0010101081

Woodhead - Molex

CONN RCPT 8POS 0.2 TIN EDGE MNT

2029

0010845041

0010845041

Woodhead - Molex

CONN HDR 4POS 0.25 TIN PCB

513

5054050870

5054050870

Woodhead - Molex

CONN RCPT 8POS 0.059 GOLD SMD

3818

0873684824

0873684824

Woodhead - Molex

CONN RCPT 48P 0.079 GOLD SMD R/A

0

0015247042

0015247042

Woodhead - Molex

CONN RCPT 4POS 0.165 GOLD PCB

0

0447640403

0447640403

Woodhead - Molex

CONN RCPT 4P 0.118 GOLD PCB R/A

0

0022172052

0022172052

Woodhead - Molex

CONN RCPT 5POS 0.1 GOLD PCB

1538

5023820670

5023820670

Woodhead - Molex

CONN RCPT 6POS 0.049 TIN SMD

193328400

0009483056

0009483056

Woodhead - Molex

CONN RCPT 5POS 0.156 GOLD PCB

2427

0901481204

0901481204

Woodhead - Molex

CONN RCPT 4POS 0.1 GOLD PCB R/A

515

0447690403

0447690403

Woodhead - Molex

CONN RCPT 4POS 0.118 GOLD PCB

0

0901512114

0901512114

Woodhead - Molex

CONN RCPT 14POS 0.1 TIN PCB

609

Rectangular Connectors - Headers, Receptacles, Female Sockets

1. Overview

Rectangular connectors are modular electrical components designed to establish reliable connections between PCBs (Printed Circuit Boards) or electronic systems. This category includes headers (male pins), receptacles (female contacts), and sockets, which enable signal/power transmission while maintaining mechanical stability. Their standardized designs and versatility make them critical in modern electronics, from consumer devices to industrial machinery.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Single-Row HeadersLinear arrangement of male pinsArduino shields, sensor modules
Double-Row HeadersDual-row pin configuration for higher densityComputer motherboards, industrial controllers
Right-Angle Receptacles90 orientation for space-constrained designsCompact medical devices, automotive sensors
Stacking Female SocketsVertical interconnection for multi-board systems3D printer control stacks, test equipment

3. Structure and Components

Typical construction includes:

  • Contact Terminals: Phosphor bronze or beryllium copper with gold/tin plating for conductivity
  • Insulation Housing: Thermoplastic materials (e.g., LCP, Nylon 6/6) for dielectric strength
  • Retention Mechanism: Polarization keys and locking tabs to prevent misalignment
  • Mounting Options: Through-hole or surface-mount (SMT) configurations

4. Key Technical Specifications

ParameterValue/RangeImportance
Current Rating0.5A - 10A per contactDetermines power transmission capacity
Contact Resistance5-20m Affects signal integrity and thermal performance
Dielectric Strength500V - 2500V ACEnsures electrical safety and insulation reliability
Operating Temperature-55 C to +125 CDefines environmental tolerance
Mating Cycles100 - 10,000 cyclesIndicates mechanical durability

5. Application Fields

  • Consumer Electronics: Smartphones, laptops, gaming consoles
  • Industrial Automation: PLCs, motor drives, sensor hubs
  • Telecommunications: 5G base stations, network routers
  • Medical Devices: Diagnostic equipment, patient monitors
  • Automotive: ECU connectors, ADAS sensors

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
TE ConnectivityMicroSpeed Rectangular Connectors
MolexPicoBlade 0.8mm Headers
AmphenolMICRO CONECTA Surface Mount Sockets
SamtecQTRADE High-Speed Receptacles

7. Selection Guidelines

Key considerations:

  • Electrical requirements (current/voltage levels)
  • PCB space constraints and stacking needs
  • Environmental factors (temperature, vibration, moisture)
  • Cost-effectiveness vs. long-term reliability
  • Compliance with standards (IPC, RoHS, REACH)

Example: For automotive applications, prioritize connectors with high vibration resistance (e.g., TE Connectivity's AMPMODU series) and AEC-Q200 certification.

8. Industry Trends

Emerging directions include:

  • Miniaturization: Sub-1.0mm pitch connectors for wearable devices
  • High-speed capabilities: 10+ Gbps data rates for 5G infrastructure
  • Enhanced reliability: Hermetic sealing for aerospace applications
  • Modular designs: Tool-less hot-swap systems for data centers
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