Rectangular Connectors - Headers, Receptacles, Female Sockets

Part Number	Description / PDF	Quantity
0009485085 Woodhead - Molex	CONN RCPT 8POS 0.156 GOLD PCB	0
5025850270 Woodhead - Molex	CONN RCPT 2POS 0.059 TIN SMD R/A	5552
0010181038 Woodhead - Molex	CONN HDR 3POS 0.198 TIN PCB	43
5023860570 Woodhead - Molex	CONN RCPT 5POS 0.049 TIN SMD R/A	7583
0009484028 Woodhead - Molex	CONN RCPT 2POS 0.156 TIN PCB	519
0010101063 Woodhead - Molex	CONN RCPT 6POS 0.2 TIN PCB	2770
0022142204 Woodhead - Molex	CONN RCPT 20POS 0.1 TIN PCB	875
0791077010 Woodhead - Molex	CONN RCPT 22POS 0.079 GOLD PCB	545
0901481210 Woodhead - Molex	CONN RCPT 10POS 0.1 GOLD PCB R/A	545
0901512126 Woodhead - Molex	CONN RCPT 26POS 0.1 TIN PCB	2
0872641852 Woodhead - Molex	CONN RCPT 18P 0.079 GOLD PCB R/A	0
0022182051 Woodhead - Molex	CONN RCPT 5POS 0.1 GOLD PCB	3273
0022142074 Woodhead - Molex	CONN RCPT 7POS 0.1 TIN PCB	53
0901481110 Woodhead - Molex	CONN RCPT 10POS 0.1 TIN PCB R/A	10
0873685024 Woodhead - Molex	CONN RCPT 50P 0.079 GOLD SMD R/A	0
5054050570 Woodhead - Molex	CONN RCPT 5POS 0.059 GOLD SMD	4258
0447641603 Woodhead - Molex	CONN RCPT 16P 0.118 GOLD PCB R/A	0
0901512112 Woodhead - Molex	CONN RCPT 12POS 0.1 TIN PCB	1768
5025850770 Woodhead - Molex	CONN RCPT 7POS 0.059 TIN SMD R/A	4147
0010845121 Woodhead - Molex	CONN HDR 12POS 0.25 TIN PCB	0

Rectangular Connectors - Headers, Receptacles, Female Sockets

1. Overview

Rectangular connectors are modular electrical components designed to establish reliable connections between PCBs (Printed Circuit Boards) or electronic systems. This category includes headers (male pins), receptacles (female contacts), and sockets, which enable signal/power transmission while maintaining mechanical stability. Their standardized designs and versatility make them critical in modern electronics, from consumer devices to industrial machinery.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Single-Row Headers	Linear arrangement of male pins	Arduino shields, sensor modules
Double-Row Headers	Dual-row pin configuration for higher density	Computer motherboards, industrial controllers
Right-Angle Receptacles	90 orientation for space-constrained designs	Compact medical devices, automotive sensors
Stacking Female Sockets	Vertical interconnection for multi-board systems	3D printer control stacks, test equipment

3. Structure and Components

Typical construction includes:

Contact Terminals: Phosphor bronze or beryllium copper with gold/tin plating for conductivity
Insulation Housing: Thermoplastic materials (e.g., LCP, Nylon 6/6) for dielectric strength
Retention Mechanism: Polarization keys and locking tabs to prevent misalignment
Mounting Options: Through-hole or surface-mount (SMT) configurations

4. Key Technical Specifications

Parameter	Value/Range	Importance
Current Rating	0.5A - 10A per contact	Determines power transmission capacity
Contact Resistance	5-20m	Affects signal integrity and thermal performance
Dielectric Strength	500V - 2500V AC	Ensures electrical safety and insulation reliability
Operating Temperature	-55 C to +125 C	Defines environmental tolerance
Mating Cycles	100 - 10,000 cycles	Indicates mechanical durability

5. Application Fields

Consumer Electronics: Smartphones, laptops, gaming consoles
Industrial Automation: PLCs, motor drives, sensor hubs
Telecommunications: 5G base stations, network routers
Medical Devices: Diagnostic equipment, patient monitors
Automotive: ECU connectors, ADAS sensors

6. Leading Manufacturers and Products

Manufacturer	Representative Product
TE Connectivity	MicroSpeed Rectangular Connectors
Molex	PicoBlade 0.8mm Headers
Amphenol	MICRO CONECTA Surface Mount Sockets
Samtec	QTRADE High-Speed Receptacles

7. Selection Guidelines

Key considerations:

Electrical requirements (current/voltage levels)
PCB space constraints and stacking needs
Environmental factors (temperature, vibration, moisture)
Cost-effectiveness vs. long-term reliability
Compliance with standards (IPC, RoHS, REACH)

Example: For automotive applications, prioritize connectors with high vibration resistance (e.g., TE Connectivity's AMPMODU series) and AEC-Q200 certification.

8. Industry Trends

Emerging directions include:

Miniaturization: Sub-1.0mm pitch connectors for wearable devices
High-speed capabilities: 10+ Gbps data rates for 5G infrastructure
Enhanced reliability: Hermetic sealing for aerospace applications
Modular designs: Tool-less hot-swap systems for data centers