Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
FFSD-13-D-12.20-01-N

FFSD-13-D-12.20-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

A1DXH-2036M

A1DXH-2036M

TE Connectivity AMP Connectors

IDC CABLE - AKR20H/AE20M/X

0

2162701041

2162701041

Woodhead - Molex

SL POSITIVE LOCK R-R 4CKT 100MM

0

A05SUR05SUR32W305A

A05SUR05SUR32W305A

JST

JUMPER 05SUR-32S - 05SUR-32S 12"

822

A10SUR10SUR32W152A

A10SUR10SUR32W152A

JST

JUMPER 10SUR-32S - 10SUR-32S 6"

362

2205113-3

2205113-3

TE Connectivity AMP Connectors

CA 200MM 06 POS. MOW-PB M-M VALU

52

C2RXG-2406G

C2RXG-2406G

CW Industries

DIP CABLE - CDP24G/AE24G/X

0

M3AGK-3436J

M3AGK-3436J

3M

IDC CABLE - MSC34K/MC34G/MCS34K

0

45112-010030-3749/12-S-6

45112-010030-3749/12-S-6

3M

SGL END CBL ASSY 12POS SKT 6"

57

M3TKK-6018R

M3TKK-6018R

3M

IDC CABLE - MSD60K/MC60M/MPK60K

0

H6MMH-2018M

H6MMH-2018M

ASSMANN WSW Components

DIP CABLE - HDM20H/AE20M/HDM20H

0

C6RRG-4018M

C6RRG-4018M

CW Industries

DIP CABLE - CDR40G/AE40M/CDR40G

0

FFSD-06-S-20.00-01-N

FFSD-06-S-20.00-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

FFSD-25-D-39.00-01-N

FFSD-25-D-39.00-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

A02ZR02ZR28H305A

A02ZR02ZR28H305A

JST

JUMPER 02ZR-8M-P - 02ZR-8M-P 12"

0

H2MXS-4036M

H2MXS-4036M

ASSMANN WSW Components

DIP CBL - HHDM40S/AE40M/X

0

FFSD-25-D-23.70-01-N

FFSD-25-D-23.70-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

FFSD-05-S-12.00-01-N

FFSD-05-S-12.00-01-N

Samtec, Inc.

CABLE ASSM .05" 10PS SGL END 12"

375

M3WWK-2636R

M3WWK-2636R

3M

IDC CABLE - MPL26K/MC26M/MPL26K

0

158210-0120-HF625/10-S-6

158210-0120-HF625/10-S-6

3M

SINGLE ENDED CABLE ASSEMBLY 10 P

0

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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