Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
FFSD-17-D-23.80-01-N

FFSD-17-D-23.80-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

A3CCH-1418G

A3CCH-1418G

TE Connectivity AMP Connectors

IDC CABLE - AKC14H/AE14G/AKC14H

0

FFSD-06-D-13.00-01-N-R

FFSD-06-D-13.00-01-N-R

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

M3WWK-3406R

M3WWK-3406R

3M

IDC CABLE - MPL34K/MC34M/MPL34K

0

C3BEG-5006G

C3BEG-5006G

CW Industries

IDC CABLE - CSR50G/AE50G/CCE60G

0

A3KKB-1618M

A3KKB-1618M

TE Connectivity AMP Connectors

IDC CABLE - APK16B/AE16M/APK16B

0

FFSD-05-S-13.75-01-N

FFSD-05-S-13.75-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

H3DWH-4006M

H3DWH-4006M

ASSMANN WSW Components

IDC CBL - HHKR40H/AE40M/HHPL40H

0

FFSD-17-D-02.60-01-N

FFSD-17-D-02.60-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

M1EXK-2636R

M1EXK-2636R

3M

IDC CABLE - MCE26K/MC26M/X

0

A100002-03

A100002-03

Multi-Tek

CA, DEUTSCH, 2 POS, TINNED PIGTA

100

M3TGK-1618J

M3TGK-1618J

3M

IDC CABLE - MSD16K/MC16G/MCS16K

0

T1SDT-03-28-GF-02.0-T3

T1SDT-03-28-GF-02.0-T3

Samtec, Inc.

CBL ASSY 1MM 6POS M TO F

0

H3CWH-6036G

H3CWH-6036G

ASSMANN WSW Components

IDC CBL - HHKC50H/AE60G/HHPL60H

3

0151370505

0151370505

Woodhead - Molex

MINI-LOCK-TO-MINI-LOCK OFF-THE-S

44

A3BBH-3418G

A3BBH-3418G

TE Connectivity AMP Connectors

IDC CABLE - ASR34H/AE34G/ASR34H

0

0151360605

0151360605

Woodhead - Molex

MICROCLASP 6 CIRCUIT 450MM

0

M3UUK-1420K

M3UUK-1420K

3M

IDC CABLE - MKS14K/MC14F/MKS14K

0

H6MMH-2636M

H6MMH-2636M

ASSMANN WSW Components

DIP CABLE - HDM26H/AE26M/HDM26H

0

A3BRB-1006M

A3BRB-1006M

TE Connectivity AMP Connectors

IDC CABLE - ASR10B/AE10M/APR10B

0

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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