Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
C3DDS-3436G

C3DDS-3436G

CW Industries

IDC CABLE - CKR34S/AE34G/CKR34S

0

2147581021

2147581021

Woodhead - Molex

MICRO-FIT3.0 P-S 2 CIRCUIT 150MM

0

H3BBH-1406M

H3BBH-1406M

ASSMANN WSW Components

IDC CBL - HHSR14H/AE14M/HHSR14H

0

H8PPS-2406G

H8PPS-2406G

ASSMANN WSW Components

DIP CABLE - HDP24S/AE24G/HDP24S

0

2163311022

2163311022

Woodhead - Molex

EDGE LOCK R-S 2CKT 150MM SN

0

G125-MC12605L4-0450L

G125-MC12605L4-0450L

Harwin

1.25MM M/L 26POS 26AWG 450MM

11

M3WWK-3606R

M3WWK-3606R

3M

IDC CABLE - MPL36K/MC37M/MPL36K

0

C3AAG-4006M

C3AAG-4006M

CW Industries

IDC CABLE - CSC40G/AE40M/CSC40G

0

FFSD-13-D-90.00-01-N

FFSD-13-D-90.00-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

A8MMS-1606G

A8MMS-1606G

TE Connectivity AMP Connectors

ADM16S/AE16G/ADM16S

0

M3UMK-1606R

M3UMK-1606R

3M

IDC CABLE - MKS16K/MC16M/MCG16K

0

A10XSR10XSR36R102A

A10XSR10XSR36R102A

JST

JUMPER 10XSR-36S - 10XSR-36S 4"

704

M3CCK-3460K

M3CCK-3460K

3M

IDC CABLE - MKC34K/MC34F/MKC34K

0

FFSD-13-D-30.00-01-N

FFSD-13-D-30.00-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

M1KXK-2036J

M1KXK-2036J

3M

IDC CABLE - MPK20K/MC20G/X

0

0923151020

0923151020

Woodhead - Molex

10CC PICOFLEX 200MM LONG

3881

M3TTK-3436J

M3TTK-3436J

3M

IDC CABLE - MSD34K/MC34G/MSD34K

0

FFSD-08-D-08.84-01-N

FFSD-08-D-08.84-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

FFSD-10-D-78.74-01-N-D59

FFSD-10-D-78.74-01-N-D59

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

A3DDB-6006M

A3DDB-6006M

TE Connectivity AMP Connectors

IDC CABLE- AKR60B/AE60M/AKR60B

0

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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