Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
H6MMS-1618G

H6MMS-1618G

ASSMANN WSW Components

DIP CBL - HHDM16S/AE16G/HHDM16S

0

A3AAB-2606G

A3AAB-2606G

TE Connectivity AMP Connectors

IDC CABLE- ASC26B/AE26G/ASC26B

0

M3DEK-3406J

M3DEK-3406J

3M

IDC CABLE - MKR34K/MC34G/MCE34K

0

M1WXK-1436J

M1WXK-1436J

3M

IDC CABLE - MPL14K/MC14G/X

0

M3CCK-2636J

M3CCK-2636J

3M

IDC CABLE - MKC26K/MC26G/MKC26K

0

FFSD-10-D-18.50-01-N-R

FFSD-10-D-18.50-01-N-R

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

FFSD-08-D-15.00-01-N

FFSD-08-D-15.00-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

299

A3AKB-3036M

A3AKB-3036M

TE Connectivity AMP Connectors

IDC CABLE - ASC30B/AE30M/APK30B

0

M3WWK-2618R

M3WWK-2618R

3M

IDC CABLE - MPL26K/MC26M/MPL26K

0

H3CKH-2018M

H3CKH-2018M

ASSMANN WSW Components

IDC CBL - HHKC20H/AE20G/HHPK20H

0

M3TKK-2018R

M3TKK-2018R

3M

IDC CABLE - MSD20K/MC20M/MPK20K

0

M3CCK-6018R

M3CCK-6018R

3M

IDC CABLE - MKC60K/MC60M/MKC60K

0

C3AEG-2618G

C3AEG-2618G

CW Industries

IDC CABLE - CSC26G/AE26G/CCE26G

0

M3BRK-4018R

M3BRK-4018R

3M

IDC CABLE - MSR40K/MC40M/MPR40K

0

2153251022

2153251022

Woodhead - Molex

MINIFIT JR DR R-R 2 CIRCUIT 300M

0

H1CXS-1036G

H1CXS-1036G

ASSMANN WSW Components

IDC CBL - HHKC10S/AE10G/X

0

H3BWH-2606M

H3BWH-2606M

ASSMANN WSW Components

IDC CBL - HHSR26H/AE26M/HHPL26H

0

C3AES-2606G

C3AES-2606G

CW Industries

IDC CABLE - CSC26S/AE26G/CCE26S

0

A3CCH-1036M

A3CCH-1036M

TE Connectivity AMP Connectors

IDC CABLE - AKC10H/AE10M/AKC10H

0

M3BRK-4020K

M3BRK-4020K

3M

IDC CABLE - MSR40K/MC40F/MPR40K

0

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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