Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
M3CCK-5060K

M3CCK-5060K

3M

IDC CABLE - MKC50K/MC50F/MKC50K

0

M3DDK-1436R

M3DDK-1436R

3M

IDC CABLE - MKR14K/MC14M/MKR14K

0

M3WWK-6420K

M3WWK-6420K

3M

IDC CABLE - MPL64K/MC64F/MPL64K

0

M3CEK-2618R

M3CEK-2618R

3M

IDC CABLE - MKC26K/MC26M/MCE26K

0

0151370206

0151370206

Woodhead - Molex

MINI-LOCK-TO-MINI-LOCK OFF-THE-S

0

FFSD-05-D-120.00-01-N

FFSD-05-D-120.00-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

A6MMS-3406G

A6MMS-3406G

TE Connectivity AMP Connectors

IDC CABLE - ADM34S/AE34G/ADM34S

0

0151370502

0151370502

Woodhead - Molex

MINI-LOCK-TO-MINI-LOCK OFF-THE-S

10

STM015PC2DC036

STM015PC2DC036

TE Connectivity Aerospace Defense and Marine

WDUALOBE CONNECTOR

0

H1DXS-6436G

H1DXS-6436G

ASSMANN WSW Components

IDC CBL - HHKR64S/AE64G/X

0

2205067-3

2205067-3

TE Connectivity AMP Connectors

CABLE ASSEMBLY HEADER WTW 18POS

187

M3DDA-2636J

M3DDA-2636J

3M

IDC CABLE - MKR26A/MC26G/MKR26A

0

M3BBA-2418R

M3BBA-2418R

3M

IDC CABLE - MSR24A/MC24M/MSR24A

0

FFSD-10-D-07.90-01-N

FFSD-10-D-07.90-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

C3DDG-5036M

C3DDG-5036M

CW Industries

IDC CABLE - CKR50G/AE50M/CKR50G

0

C3CEG-2618G

C3CEG-2618G

CW Industries

IDC CABLE - CKC26G/AE26G/CCE26G

0

FFSD-25-D-42.00-01-N-R

FFSD-25-D-42.00-01-N-R

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

A3DDB-1018G

A3DDB-1018G

TE Connectivity AMP Connectors

IDC CABLE- AKR10B/AE10G/AKR10B

0

M1AXK-3436R

M1AXK-3436R

3M

IDC CABLE - MSC34K/MC34M/X

0

FFSD-06-D-09.00-01-N

FFSD-06-D-09.00-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
RFQ BOM Call Skype Email
Top