Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
A3DDH-2406M

A3DDH-2406M

TE Connectivity AMP Connectors

IDC CABLE - AKR24H/AE24M/AKR24H

0

2162711083

2162711083

Woodhead - Molex

SL POSITIVE LOCK R-S 8CKT 300MM

0

FFSD-10-D-04.06-01-N

FFSD-10-D-04.06-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

T1PDT-10-28-GF-06.0-A-T3

T1PDT-10-28-GF-06.0-A-T3

Samtec, Inc.

CBL 1MM 20POS PNL MNT M TO F

4

M3TGK-2006J

M3TGK-2006J

3M

IDC CABLE - MSD20K/MC20G/MCS20K

0

H3BBS-2606G

H3BBS-2606G

ASSMANN WSW Components

IDC CBL - HHSR26H/AE26G/HHSR26H

0

D89116-0131HK-3365/16-D-6

D89116-0131HK-3365/16-D-6

3M

CABLE 16POS SOCKET TO SOCKET 6"

0

M3UYK-5018R

M3UYK-5018R

3M

IDC CABLE - MKS50K/MC50M/MPD50K

0

M3CFK-5020K

M3CFK-5020K

3M

IDC CABLE - MKC50K/MC50F/MCF50K

0

FFSD-19-D-03.00-01-N-R

FFSD-19-D-03.00-01-N-R

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

FFSD-08-D-08.36-01-N-D04

FFSD-08-D-08.36-01-N-D04

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

SEAC-030-10-06.0-TU-TU-N

SEAC-030-10-06.0-TU-TU-N

Samtec, Inc.

CBL ASSM M-M 300POS 6" HDR

0

C8RRS-1636G

C8RRS-1636G

CW Industries

DIP CABLE - CDR16S/AE16G/CDR16S

0

2153212031

2153212031

Woodhead - Molex

MINIFIT JR SR R-S 3 CIRCUIT 150M

100

M3CCA-2018J

M3CCA-2018J

3M

IDC CABLE - MKC20A/MC20G/MKC20A

0

A3KKB-3006M

A3KKB-3006M

TE Connectivity AMP Connectors

IDC CABLE - APK30B/AE30M/APK30B

0

M3CKK-2020K

M3CKK-2020K

3M

IDC CABLE - MKC20K/MC20F/MPK20K

0

H3CWH-3436M

H3CWH-3436M

ASSMANN WSW Components

IDC CBL - HHKC34H/AE34M/HHPL34H

0

FFSD-05-D-12.00-01-N-D06

FFSD-05-D-12.00-01-N-D06

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

45120-010030-7700/20-F-06

45120-010030-7700/20-F-06

3M

CABLE ASSY 20 POS 6" PINOUT-F

0

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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