Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
M1WXK-6036R

M1WXK-6036R

3M

IDC CABLE - MPL60K/MC60M/X

0

FFSD-05-D-23.00-01-N

FFSD-05-D-23.00-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

M3UFK-1640K

M3UFK-1640K

3M

IDC CABLE - MKS16K/MC16F/MCF16K

0

HLCD-20-01.72-TR-TR-1

HLCD-20-01.72-TR-TR-1

Samtec, Inc.

0.50 MM RAZOR BEAM HIGH-SPEED H

0

M3BGK-5018J

M3BGK-5018J

3M

IDC CABLE - MSR50K/MC50G/MCS50K

0

M3TEK-1036J

M3TEK-1036J

3M

IDC CABLE - MSD10K/MC10G/MCE10K

0

H3BKH-2036G

H3BKH-2036G

ASSMANN WSW Components

IDC CBL - HHSR20H/AE20G/HHPK20H

0

FFSD-05-D-09.00-01-N-R

FFSD-05-D-09.00-01-N-R

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

45110-010030-3749/10-D-6

45110-010030-3749/10-D-6

3M

DBL END CBL ASY 10POS SKT 6"

49

FFSD-11-D-18.00-01-N

FFSD-11-D-18.00-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

2162911032

2162911032

Woodhead - Molex

STANDARD .093 3 CIRCUIT R TO S 3

0

H3CCS-3436M

H3CCS-3436M

ASSMANN WSW Components

IDC CBL - HHKC34S/AE34M/HHKC34S

0

M3UGK-4006R

M3UGK-4006R

3M

IDC CABLE - MKS40K/MC40M/MCS40K

0

FFSD-20-D-04.00-01-N-RW-R

FFSD-20-D-04.00-01-N-RW-R

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

M3RRK-3418J

M3RRK-3418J

3M

IDC CABLE - MPR34K/MC34G/MPR34K

0

H3WWH-1036G

H3WWH-1036G

ASSMANN WSW Components

IDC CBL - HHPL10H/AE10G/HHPL10H

0

M3UUK-1618J

M3UUK-1618J

3M

IDC CABLE - MKS16K/MC16G/MKS16K

0

2162701052

2162701052

Woodhead - Molex

SL POSITIVE LOCK R-R 5CKT 150MM

0

0369200400

0369200400

Woodhead - Molex

PICOEZMATE 4 CIRCUIT 50MM

1491

A3DKB-1406M

A3DKB-1406M

TE Connectivity AMP Connectors

IDC CABLE - AKR14B/AE14M/APK14B

0

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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