Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
M3BEK-6036R

M3BEK-6036R

3M

IDC CABLE - MSR60K/MC60M/MCE60K

0

M3DDK-4018R

M3DDK-4018R

3M

IDC CABLE - MKR40K/MC40M/MKR40K

0

FFSD-12-D-31.50-01-N

FFSD-12-D-31.50-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

M3BYK-1036R

M3BYK-1036R

3M

IDC CABLE - MSR10K/MC10M/MPD10K

0

M3BYK-6036J

M3BYK-6036J

3M

IDC CABLE - MSR60K/MC60G/MPD60K

0

C8RRG-4018M

C8RRG-4018M

CW Industries

DIP CABLE - CDR40G/AE40M/CDR40G

0

A6MMS-2418G

A6MMS-2418G

TE Connectivity AMP Connectors

IDC CABLE - ADM24S/AE24G/ADM24S

0

C3PPS-5036G

C3PPS-5036G

CW Industries

IDC CABLE - CPC50S/AE50G/CPC50S

0

M3AKK-3436J

M3AKK-3436J

3M

IDC CABLE - MSC34K/MC34G/MPK34K

0

M3BBK-1018J

M3BBK-1018J

3M

IDC CABLE - MSR10K/MC10G/MSR10K

0

FFSD-07-D-16.00-01-N

FFSD-07-D-16.00-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

A3DDH-3418G

A3DDH-3418G

TE Connectivity AMP Connectors

IDC CABLE - AKR34H/AE34G/AKR34H

0

M1WXK-3436J

M1WXK-3436J

3M

IDC CABLE - MPL34K/MC34G/X

0

FFSD-25-D-09.50-01-N-RW

FFSD-25-D-09.50-01-N-RW

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

SEAC-020-08-40.0-TU-TU

SEAC-020-08-40.0-TU-TU

Samtec, Inc.

CBL ASSM M-M 160POS 40" HDR

10

FFSD-13-D-18.00-01-N-R

FFSD-13-D-18.00-01-N-R

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

0369210410

0369210410

Woodhead - Molex

L1NK 396 4 CIRCUIT 1000MM

92

A3RRB-3436M

A3RRB-3436M

TE Connectivity AMP Connectors

IDC CABLE - APR34B/AE34G/APR34B

0

M3BMK-2606J

M3BMK-2606J

3M

IDC CABLE - MSR26K/MC26G/MCG26K

0

M3DYK-3418J

M3DYK-3418J

3M

IDC CABLE - MKR34K/MC34G/MPD34K

0

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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