Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
H6MMS-4036M

H6MMS-4036M

ASSMANN WSW Components

DIP CBL - HHDM40S/AE40M/HHDM40S

0

A3CCH-3006M

A3CCH-3006M

TE Connectivity AMP Connectors

IDC CABLE - AKC30H/AE30M/AKC30H

0

A3AAB-5036G

A3AAB-5036G

TE Connectivity AMP Connectors

IDC CABLE- ASC50B/AE50G/ASC50B

0

H3AAH-5018M

H3AAH-5018M

ASSMANN WSW Components

IDC CBL - HHSC50H/AE50M/HHSC50H

0

0151350606

0151350606

Woodhead - Molex

CLICKMATE 6 CIRCUIT 600MM

1197

M3BFK-2020K

M3BFK-2020K

3M

IDC CABLE - MSR20K/MC20F/MCF20K

0

FFSD-08-D-09.84-01-N

FFSD-08-D-09.84-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

A2MXS-3418G

A2MXS-3418G

TE Connectivity AMP Connectors

ADM34S/AE34G/X

0

ISDCB812

ISDCB812

NKK Switches

CABLE RIBBON 12"

322300

FFSD-25-D-14.00-01-N-RN2

FFSD-25-D-14.00-01-N-RN2

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

FFSD-13-D-32.00-01-N

FFSD-13-D-32.00-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

M3AAA-2406R

M3AAA-2406R

3M

IDC CABLE - MSC24A/MC24M/MSC24A

0

0151350203

0151350203

Woodhead - Molex

CLICKMATE 2 CIRCUIT 300MM

1461

M3GGK-6420K

M3GGK-6420K

3M

IDC CABLE - MCS64K/MC64F/MCS64K

0

M3DGK-6018R

M3DGK-6018R

3M

IDC CABLE - MKR60K/MC60M/MCS60K

0

M3BBA-1036R

M3BBA-1036R

3M

IDC CABLE - MSR10A/MC10M/MSR10A

0

H6PPH-1418M

H6PPH-1418M

ASSMANN WSW Components

DIP CABLE - HDP14H/AE14M/HDP14H

0

M3BGK-2006R

M3BGK-2006R

3M

IDC CABLE - MSR20K/MC20M/MCS20K

0

M3UEK-2660K

M3UEK-2660K

3M

IDC CABLE - MKS26K/MC26F/MCE26K

0

C3AAG-2036M

C3AAG-2036M

CW Industries

IDC CABLE - CSC20G/AE20M/CSC20G

0

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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