Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
FFSD-25-D-64.00-01-N-R

FFSD-25-D-64.00-01-N-R

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

A3DKB-2006M

A3DKB-2006M

TE Connectivity AMP Connectors

IDC CABLE - AKR20B/AE20M/APK20B

0

M3AMK-4040K

M3AMK-4040K

3M

IDC CABLE - MSC40K/MC40F/MCG40K

0

0369200505

0369200505

Woodhead - Molex

PICOEZMATE 5 CIRCUIT 450MM

168

A3BBB-1406G

A3BBB-1406G

TE Connectivity AMP Connectors

IDC CABLE- ASR14B/AE14G/ASR14B

0

M3CCK-1406J

M3CCK-1406J

3M

IDC CABLE - MKC14K/MC14G/MKC14K

0

H2MXH-1636G

H2MXH-1636G

ASSMANN WSW Components

DIP CABLE - HDM16H/AE16G/X

0

M3CWK-5060K

M3CWK-5060K

3M

IDC CABLE - MKC50K/MC50F/MPL50K

0

FFSD-20-D-137.80-01-N

FFSD-20-D-137.80-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

158120-1100-HF625/20-D-3

158120-1100-HF625/20-D-3

3M

CABLE 20POS SOCKET TO SOCKET 3"

0

M3UMK-1006J

M3UMK-1006J

3M

IDC CABLE - MKS10K/MC10G/MCG10K

0

C1DXS-6036G

C1DXS-6036G

CW Industries

IDC CABLE - CKR60S/AE60G/X

0

A3BBH-3436M

A3BBH-3436M

TE Connectivity AMP Connectors

IDC CABLE - ASR34H/AE34M/ASR34H

0

M3CGK-6018J

M3CGK-6018J

3M

IDC CABLE - MKC60K/MC60G/MCS60K

0

M3DYK-2406J

M3DYK-2406J

3M

IDC CABLE - MKR24K/MC24G/MPD24K

0

M3UFK-1618J

M3UFK-1618J

3M

IDC CABLE - MKS16K/MC16G/MCF16K

0

M3CCA-5006J

M3CCA-5006J

3M

IDC CABLE - MKC50A/MC50G/MKC50A

0

M3UYK-1040K

M3UYK-1040K

3M

IDC CABLE - MKS10K/MC10F/MPD10K

0

M3BFK-2036J

M3BFK-2036J

3M

IDC CABLE - MSR20K/MC20G/MCF20K

0

FFSD-20-D-35.00-01-N

FFSD-20-D-35.00-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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