Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
A3BKB-2636M

A3BKB-2636M

TE Connectivity AMP Connectors

IDC CABLE- ASR26B/AE26M/APK26B

0

FFSD-12-D-02.50-01-N-R

FFSD-12-D-02.50-01-N-R

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

M3URK-6006J

M3URK-6006J

3M

IDC CABLE - MKS60K/MC60G/MPR60K

0

A22XSR22XSR36R254B

A22XSR22XSR36R254B

JST

JUMPER 22XSR-36S - 22XSR-36S 10"

949

A3BBH-4018G

A3BBH-4018G

TE Connectivity AMP Connectors

IDC CABLE - ASR40H/AE40G/ASR40H

0

45114-010030-3749/14-D-6

45114-010030-3749/14-D-6

3M

DBL END CBL ASY 14POS SKT 6"

36

FFSD-20-D-03.15-01-N

FFSD-20-D-03.15-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

A3AKB-2018M

A3AKB-2018M

TE Connectivity AMP Connectors

IDC CABLE - ASC20B/AE20M/APK20B

0

M3DRK-5036R

M3DRK-5036R

3M

IDC CABLE - MKR50K/MC50M/MPR50K

0

A3AAH-5036G

A3AAH-5036G

TE Connectivity AMP Connectors

IDC CABLE - ASC50H/AE50G/ASC50H

0

M3DGK-1636J

M3DGK-1636J

3M

IDC CABLE - MKR16K/MC16G/MCS16K

0

FFSD-25-D-112.00-01-N

FFSD-25-D-112.00-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

FFSD-07-D-02.75-01-N

FFSD-07-D-02.75-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

C4PXG-1606M

C4PXG-1606M

CW Industries

DIP CABLE - CDP16G/AE16M/X

0

C4PXS-4018M

C4PXS-4018M

CW Industries

DIP CABLE - CDP40S/AE40M/X

0

M1DXA-2036R

M1DXA-2036R

3M

IDC CABLE - MKR20A/MC20M/X

0

M3BBA-4006R

M3BBA-4006R

3M

IDC CABLE - MSR40A/MC40M/MSR40A

0

FFSD-25-D-05.25-01-N

FFSD-25-D-05.25-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

2153271021

2153271021

Woodhead - Molex

MINIFIT JR DR P-P 2 CIRCUIT 150M

0

FFSD-08-D-08.77-01-N

FFSD-08-D-08.77-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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