Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
H3DKH-6018M

H3DKH-6018M

ASSMANN WSW Components

IDC CBL - HHKR60H/AE60M/HHPK60H

0

09476161200

09476161200

HARTING

HPP V4 HYBRID DOUBLE ENDED CABLE

0

2162931042

2162931042

Woodhead - Molex

STANDARD .093 4 CIRCUIT P TO S 3

0

M3CKK-4006J

M3CKK-4006J

3M

IDC CABLE - MKC40K/MC40G/MPK40K

0

FFSD-25-D-08.22-01-N

FFSD-25-D-08.22-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

M3BBA-5036J

M3BBA-5036J

3M

IDC CABLE - MSR50A/MC50G/MSR50A

0

T1PST-03-28-GF-02.0-A-T3

T1PST-03-28-GF-02.0-A-T3

Samtec, Inc.

CBL 1MM 3POS PNL MNT M TO F

20

H3CWH-2618M

H3CWH-2618M

ASSMANN WSW Components

IDC CBL - HHKC26H/AE26M/HHPL26H

0

0151330702

0151330702

Woodhead - Molex

PICO-CLASP 7CIRCUIT 150MM

851

A2MXS-1606G

A2MXS-1606G

TE Connectivity AMP Connectors

ADM16S/AE16G/X

0

C6RRG-2418G

C6RRG-2418G

CW Industries

DIP CABLE - CDR24G/AE24G/CDR24G

0

C8RRS-4036M

C8RRS-4036M

CW Industries

DIP CABLE - CDR40S/AE40M/CDR40S

0

FFSD-08-D-09.00-01-F-N

FFSD-08-D-09.00-01-F-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

FFSD-25-D-36.00-01-N-R

FFSD-25-D-36.00-01-N-R

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

FFSD-20-D-14.00-01-N-R

FFSD-20-D-14.00-01-N-R

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

FFSD-11-D-06.00-01-N

FFSD-11-D-06.00-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

M3UEK-6040K

M3UEK-6040K

3M

IDC CABLE - MKS60K/MC60F/MCE60K

0

A1DXH-2436G

A1DXH-2436G

TE Connectivity AMP Connectors

IDC CABLE - AKR24H/AE24G/X

0

0151350405

0151350405

Woodhead - Molex

CLICKMATE 4 CIRCUIT 450MM

0

0151340705

0151340705

Woodhead - Molex

PICOBLADE 7 CIRCUIT 450MM

0

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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