Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
FFSD-11-D-08.00-01-N

FFSD-11-D-08.00-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

A3AAH-2606M

A3AAH-2606M

TE Connectivity AMP Connectors

IDC CABLE - ASC26H/AE26M/ASC26H

0

FFSD-20-D-11.81-01-N

FFSD-20-D-11.81-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

FFSD-08-D-17.00-01-N-D08

FFSD-08-D-17.00-01-N-D08

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

C1EXS-1036M

C1EXS-1036M

CW Industries

IDC CABLE - CCE10S/AE10M/X

0

M3CMK-5018R

M3CMK-5018R

3M

IDC CABLE - MKC50K/MC50M/MCG50K

0

FFSD-08-D-11.82-01-N

FFSD-08-D-11.82-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

M3AEK-2636J

M3AEK-2636J

3M

IDC CABLE - MSC26K/MC26G/MCE26K

0

M3AAK-3418J

M3AAK-3418J

3M

IDC CABLE - MSC34K/MC34G/MSC34K

0

1410726

1410726

Phoenix Contact

SAC-2P- 5 0-PUR/DTFS

87

0369210600

0369210600

Woodhead - Molex

L1NK 396 6 CIRCUIT 75MM

235

H8PPS-4036G

H8PPS-4036G

ASSMANN WSW Components

DIP CABLE - HDP40S/AE40G/HDP40S

0

M3AGK-4018R

M3AGK-4018R

3M

IDC CABLE - MSC40K/MC40M/MCS40K

0

FFSD-07-D-02.50-01-N

FFSD-07-D-02.50-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

C3BBS-2636G

C3BBS-2636G

CW Industries

IDC CABLE - CSR26S/AE26G/CSR26S

0

M3CKK-2618R

M3CKK-2618R

3M

IDC CABLE - MKC26K/MC26M/MPK26K

0

FFSD-13-D-14.00-01-N

FFSD-13-D-14.00-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

A3RRB-2006G

A3RRB-2006G

TE Connectivity AMP Connectors

IDC CABLE - APR20B/AE20G/APR20B

0

M3TKK-1618R

M3TKK-1618R

3M

IDC CABLE - MSD16K/MC16M/MPK16K

0

M3BBA-6018J

M3BBA-6018J

3M

IDC CABLE - MSR60A/MC60G/MSR60A

0

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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