Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
C1CXS-2036M

C1CXS-2036M

CW Industries

IDC CABLE - CKC20S/AE20M/X

0

A6MMS-1036G

A6MMS-1036G

TE Connectivity AMP Connectors

IDC CABLE - ADM10S/AE10G/ADM10S

0

A10KR10KR26E254A

A10KR10KR26E254A

JST

JUMPER 10KR-6S-P - 10KR-6S-P 10"

969

45130-010030-7700/30-H-24

45130-010030-7700/30-H-24

3M

CABLE ASSY 30 POS 24" PINOUT-H

0

FFSD-25-D-07.00-01-F-N

FFSD-25-D-07.00-01-F-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

FFSD-05-D-04.92-01-N

FFSD-05-D-04.92-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

A06ZR06ZR28H51B

A06ZR06ZR28H51B

JST

JUMPER 06ZR-8M-P - 06ZR-8M-P 2"

1971

FFSD-17-D-26.90-01-N

FFSD-17-D-26.90-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

H1WXH-4036M

H1WXH-4036M

ASSMANN WSW Components

IDC CBL - HHPL40H/AE40M/X

0

M3UUK-3018J

M3UUK-3018J

3M

IDC CABLE - MKS30K/MC34G/MKS30K

0

FFSD-25-D-06.14-01-N-R

FFSD-25-D-06.14-01-N-R

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

C1CXS-1436M

C1CXS-1436M

CW Industries

IDC CABLE - CKC14S/AE14M/X

0

2162861041

2162861041

Woodhead - Molex

MX150 R-S DR 4CKT 150MM SN SEALE

0

FFSD-25-D-11.81-01-N

FFSD-25-D-11.81-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

M3AEK-5020K

M3AEK-5020K

3M

IDC CABLE - MSC50K/MC50F/MCE50K

0

2162701032

2162701032

Woodhead - Molex

SL POSITIVE LOCK R-R 3CKT 150MM

0

H3AAS-1606M

H3AAS-1606M

ASSMANN WSW Components

IDC CBL - HHSC16S/AE16M/HHSC16S

0

C3BBS-5006G

C3BBS-5006G

CW Industries

IDC CABLE - CSR50S/AE50G/CSR50S

0

FFSD-05-D-31.50-01-N

FFSD-05-D-31.50-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

BF4MC-6GTXRX-B1-2M

BF4MC-6GTXRX-B1-2M

Hirose

HGH SPD OPTCL TRANS

0

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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