Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
FFSD-13-D-30.00-01-N-D15

FFSD-13-D-30.00-01-N-D15

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

M3AAK-1018R

M3AAK-1018R

3M

IDC CABLE - MSC10K/MC10M/MSC10K

0

A3DDH-2436M

A3DDH-2436M

TE Connectivity AMP Connectors

IDC CABLE - AKR24H/AE24M/AKR24H

0

M300-FC20605F2-0450L

M300-FC20605F2-0450L

Harwin

CBL ASS 3MM F 6POS DUAL 450MM

19

M3BGK-4006J

M3BGK-4006J

3M

IDC CABLE - MSR40K/MC40G/MCS40K

0

C3EEG-2636M

C3EEG-2636M

CW Industries

IDC CABLE - CCE26G/AE26M/CCE26G

0

FFSD-05-D-48.00-01-F-N

FFSD-05-D-48.00-01-F-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

C3BBS-6036M

C3BBS-6036M

CW Industries

IDC CABLE - CSR60S/AE60M/CSR60S

0

M3BBA-4040K

M3BBA-4040K

3M

IDC CABLE - MSR40A/MC40F/MSR40A

0

M3AKK-1040K

M3AKK-1040K

3M

IDC CABLE - MSC10K/MC10F/MPK10K

0

C8PPS-2406G

C8PPS-2406G

CW Industries

DIP CABLE - CDP24S/AE24G/CDP24S

0

M1BXA-2436R

M1BXA-2436R

3M

IDC CABLE - MSR24A/MC24M/X

0

158220-0120-3625/20-D-6

158220-0120-3625/20-D-6

3M

CABLE 20POS SOCKET TO SOCKET 6"

0

FFSD-17-D-10.63-01-N

FFSD-17-D-10.63-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

C3PPS-2006G

C3PPS-2006G

CW Industries

IDC CABLE - CPC20S/AE20G/CPC20S

43

FFSD-13-D-17.50-01-N

FFSD-13-D-17.50-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

M3TTK-3406R

M3TTK-3406R

3M

IDC CABLE - MSD34K/MC34M/MSD34K

0

M3GGK-2020K

M3GGK-2020K

3M

IDC CABLE - MCS20K/MC20F/MCS20K

0

FFSD-05-S-15.80-01-N

FFSD-05-S-15.80-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

FFSD-15-D-11.81-01-N

FFSD-15-D-11.81-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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