Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
FFSD-20-D-04.00-01-N-D02

FFSD-20-D-04.00-01-N-D02

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

H3CCH-3018G

H3CCH-3018G

ASSMANN WSW Components

IDC CBL - HHKC30H/AE30G/HHKC30H

0

C4PXG-1406G

C4PXG-1406G

CW Industries

DIP CABLE - CDP14G/AE14G/X

0

M3TMK-4036R

M3TMK-4036R

3M

IDC CABLE - MSD40K/MC40M/MCG40K

0

A3RRB-1618M

A3RRB-1618M

TE Connectivity AMP Connectors

IDC CABLE - APR16B/AE16M/APR16B

0

2153231022

2153231022

Woodhead - Molex

MINIFIT JR SR M-S 2 CIRCUIT 300M

125

H3CCS-6006G

H3CCS-6006G

ASSMANN WSW Components

IDC CBL - HHKC60S/AE60G/HHKC60S

0

C3DEG-1036M

C3DEG-1036M

CW Industries

IDC CABLE - CKR10G/AE10M/CCE10G

0

M3AAK-2018R

M3AAK-2018R

3M

IDC CABLE - MSC20K/MC20M/MSC20K

0

M3DYK-6036R

M3DYK-6036R

3M

IDC CABLE - MKR60K/MC60M/MPD60K

0

SEAC-030-04-06.0-TU-TU-N

SEAC-030-04-06.0-TU-TU-N

Samtec, Inc.

CBL ASSM M-M 120POS 6" HDR

0

A3DDH-5006G

A3DDH-5006G

TE Connectivity AMP Connectors

IDC CABLE - AKR50H/AE50G/AKR50H

0

T1PDT-08-28-GF-12.0-A-T3

T1PDT-08-28-GF-12.0-A-T3

Samtec, Inc.

CBL 1MM 16POS PNL MNT M TO F

0

M3DDA-1418J

M3DDA-1418J

3M

IDC CABLE - MKR14A/MC14G/MKR14A

0

TCSD-22-D-18.00-01-F

TCSD-22-D-18.00-01-F

Samtec, Inc.

CABLE IDC 22POS 18"

0

FFSD-10-D-07.50-01-N

FFSD-10-D-07.50-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

A1DXB-4036G

A1DXB-4036G

TE Connectivity AMP Connectors

IDC CABLE- AKR40B/AE40G/X

0

FFSD-08-D-84.00-01-N

FFSD-08-D-84.00-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

H3BKH-5036M

H3BKH-5036M

ASSMANN WSW Components

IDC CBL - HHSR50H/AE50M/HHPK50H

0

M3BMK-1006J

M3BMK-1006J

3M

IDC CABLE - MSR10K/MC10G/MCG10K

0

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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