Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
FFSD-10-D-26.25-01-N

FFSD-10-D-26.25-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

A3BRB-1436M

A3BRB-1436M

TE Connectivity AMP Connectors

IDC CABLE - ASR14B/AE14M/APR14B

0

A3DDB-4418M

A3DDB-4418M

TE Connectivity AMP Connectors

IDC CABLE- AKR44B/AE50M/AKR44B

0

A3DDB-1436G

A3DDB-1436G

TE Connectivity AMP Connectors

IDC CABLE- AKR14B/AE14G/AKR14B

0

FFSD-05-D-03.25-01-N

FFSD-05-D-03.25-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

FFSD-20-D-15.00-01-N-D07.5

FFSD-20-D-15.00-01-N-D07.5

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

A09ZR09ZR28H51A

A09ZR09ZR28H51A

JST

JUMPER 09ZR-8M-P - 09ZR-8M-P 2"

958

2162721062

2162721062

Woodhead - Molex

SL POSITIVE LOCK P-P 6CKT 150MM

0

M3CCK-5040K

M3CCK-5040K

3M

IDC CABLE - MKC50K/MC50F/MKC50K

0

FFSD-17-D-34.00-01-N

FFSD-17-D-34.00-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

H1CXS-2036G

H1CXS-2036G

ASSMANN WSW Components

IDC CBL - HHKC20S/AE20G/X

0

C6RRS-2436M

C6RRS-2436M

CW Industries

DIP CABLE - CDR24S/AE24M/CDR24S

0

TCSD-05-D-03.00-01-N

TCSD-05-D-03.00-01-N

Samtec, Inc.

2MM DOUBLE ROW FEMALE IDC ASSEMB

159

A1DXB-1036M

A1DXB-1036M

TE Connectivity AMP Connectors

IDC CABLE- AKR10B/AE10M/X

0

A3AAB-1606G

A3AAB-1606G

TE Connectivity AMP Connectors

IDC CABLE- ASC16B/AE16G/ASC16B

0

A8MMS-2618M

A8MMS-2618M

TE Connectivity AMP Connectors

ADM26S/AE26M/ADM26S

0

H3AKH-1006M

H3AKH-1006M

ASSMANN WSW Components

IDC CBL - HHSC10H/AE10M/HHPK10H

0

H3CKH-2606M

H3CKH-2606M

ASSMANN WSW Components

IDC CBL - HHKC26H/AE26M/HHPK26H

0

H8MMS-4036G

H8MMS-4036G

ASSMANN WSW Components

DIP CBL - HHDM40S/AE40G/HHDM40S

0

M3BBA-1060K

M3BBA-1060K

3M

IDC CABLE - MSR10A/MC10F/MSR10A

0

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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