Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
HLCD-50-40.00-TR-TR-1

HLCD-50-40.00-TR-TR-1

Samtec, Inc.

CBL ASS SELF-MATE 100POS 40" HDR

10

C3DPS-2036M

C3DPS-2036M

CW Industries

IDC CABLE - CKR20S/AE20M/CPC20S

0

HQCD-060-12.00-TED-SED-1-B

HQCD-060-12.00-TED-SED-1-B

Samtec, Inc.

CBL ASSM M-F 120POS 12" HDR

0

C1AXG-1436G

C1AXG-1436G

CW Industries

IDC CABLE - CSC14G/AE14G/X

0

0151360702

0151360702

Woodhead - Molex

MICROCLASP 7 CIRCUIT 150MM

0

G125-MC11205M1-0300M1

G125-MC11205M1-0300M1

Harwin

CBL GECKO 1.25MM M-M 300MM 12POS

9

C3CCG-4018G

C3CCG-4018G

CW Industries

IDC CABLE - CKC40G/AE40G/CKC40G

0

M3BFK-6060K

M3BFK-6060K

3M

IDC CABLE - MSR60K/MC60F/MCF60K

0

H0PPS-1436G

H0PPS-1436G

ASSMANN WSW Components

DIP CABLE - HDP14S/AE14G/HDP14S

0

M3DYK-4040K

M3DYK-4040K

3M

IDC CABLE - MKR40K/MC40F/MPD40K

0

A1CXB-4036M

A1CXB-4036M

TE Connectivity AMP Connectors

IDC CABLE- AKC40B/AE40M/X

0

M3UUK-3006R

M3UUK-3006R

3M

IDC CABLE - MKS30K/MC34M/MKS30K

0

M1AXA-5040K

M1AXA-5040K

3M

IDC CABLE - MSC50A/MC50F/X

0

FFSD-08-D-07.87-01-N-RW

FFSD-08-D-07.87-01-N-RW

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

A3CCB-1036M

A3CCB-1036M

TE Connectivity AMP Connectors

IDC CABLE- AKC10B/AE10M/AKC10B

0

M3GGK-1618R

M3GGK-1618R

3M

IDC CABLE - MCS16K/MC16M/MCS16K

0

C3DDS-1006M

C3DDS-1006M

CW Industries

IDC CABLE - CKR10S/AE10M/CKR10S

0

M3AWK-2020K

M3AWK-2020K

3M

IDC CABLE - MSC20K/MC20F/MPL20K

0

A1BXB-5036G

A1BXB-5036G

TE Connectivity AMP Connectors

IDC CABLE- ASR50B/AE50G/X

0

FFSD-15-D-15.00-01-N

FFSD-15-D-15.00-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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